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Jing-Cheng Lin

TSMC

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Publication

Featured researches published by Jing-Cheng Lin.

Archive | 2010

Embedded 3D Interposer Structure

Ying-Ching Shih; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

Archive | 2014

TSV structures and methods for forming the same

Yung-Chi Lin; Hsin-Yu Chen; Wen-Chih Chiou; Ku-Feng Yang; Tsang-Jiuh Wu; Jing-Cheng Lin

Archive | 2010

Alignment marks in substrate having through-substrate via (TSV)

Hsin Chang; Fang Wen Tsai; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng

Archive | 2010

Alignment mark and method of formation

Chen-Yu Tsai; Shih-Hui Wang; Chien-Ming Chiu; Chia-Ho Chen; Fang Wen Tsai; Weng-Jin Wu; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

Archive | 2010

Copper Bump Structures Having Sidewall Protection Layers

Jing-Cheng Lin; Ya-Hsi Hwung; Hsin-Yu Chen; Po-Hao Tsai; Yan-Fu Lin; Cheng-Lin Huang; Fang Wen Tsai; Wen-Chih Chiou

Archive | 2010

Substrate bonding system and method of modifying the same

Yu-Liang Lin; Weng-Jin Wu; Jing-Cheng Lin

Archive | 2014

Through Silicon Via with Embedded Barrier Pad

Yung-Chi Lin; Wen-Chih Chiou; Yen-Hung Chen; Sylvia Lo; Jing-Cheng Lin

Archive | 2010

Composite carrier structure

Ying-Ching Shih; Weng-Jin Wu; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

Archive | 2010

Semiconductor Molding Chamber

Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

Archive | 2010

Semiconductor Device Cover Mark

Yan-Fu Lin; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

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Collaboration

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Wen-Chih Chiou

TSMC

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Chen-Hua Yu

TSMC

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Shin-puu Jeng

TSMC

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Weng-Jin Wu

TSMC

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Fang Wen Tsai

TSMC

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Hsin-Yu Chen

TSMC

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Yung-Chi Lin

TSMC

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Hsin Chang

TSMC

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Ku-Feng Yang

TSMC

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Yan-Fu Lin

TSMC

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