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Weng-Jin Wu

TSMC

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Publication

Featured researches published by Weng-Jin Wu.

Archive | 2009

Through-Silicon Via Sidewall Isolation Structure

Chen-Hua Yu; Wen-Chih Chiou; Weng-Jin Wu

Archive | 2006

Stacked structures and methods of fabricating stacked structures

Chen-Hua Yu; Wen-Chih Chiou; Weng-Jin Wu; Jean Wang

Archive | 2013

Method for stacking semiconductor dies

Ku-Feng Yang; Weng-Jin Wu; Wen-Chih Chiou; Chen-Hua Yu

Archive | 2008

Through via process

Wen-Chih Chiou; Chen-Hua Yu; Weng-Jin Wu; Jung-Chih Hu

Archive | 2011

Formation of Through Via before Contact Processing

Wen-Chih Chiou; Chen-Hua Yu; Weng-Jin Wu

Archive | 2010

Three-dimensional integrated circuits with protection layers

Chen-Hua Yu; Wen-Chih Chiou; Weng-Jin Wu; Hung-Jung Tu; Ku-Feng Yang

Archive | 2010

Multi-die stacking using bumps with different sizes

Weng-Jin Wu; Ying-Ching Shih; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

Archive | 2009

Barrier for through-silicon via

Chen-Hua Yu; Wen-Chih Chiou; Weng-Jin Wu

Archive | 2008

System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack

Hung-Pin Chang; Weng-Jin Wu; Wen-Chih Chiou; Chen-Hua Yu

Archive | 2010

Alignment mark and method of formation

Chen-Yu Tsai; Shih-Hui Wang; Chien-Ming Chiu; Chia-Ho Chen; Fang Wen Tsai; Weng-Jin Wu; Jing-Cheng Lin; Wen-Chih Chiou; Shin-puu Jeng; Chen-Hua Yu

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Collaboration

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Wen-Chih Chiou

TSMC

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Chen-Hua Yu

TSMC

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Ku-Feng Yang

TSMC

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Jing-Cheng Lin

TSMC

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Jung-Chih Hu

TSMC

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Shin-puu Jeng

TSMC

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Hung-Jung Tu

TSMC

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Hung-Pin Chang

TSMC

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Ying-Ching Shih

TSMC

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Jean Wang

TSMC

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