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Dive into the research topics where Joerg Muchow is active.

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Featured researches published by Joerg Muchow.


Proceedings of SPIE | 2003

Monocrystalline Si membranes for pressure sensors fabricated by a novel surface micromachining process using porous silicon

Hans Artmann; Frank Schaefer; Gerhard Lammel; Simon Armbruster; Hubert Benzel; Christoph Schelling; Heribert Weber; Heinz-Georg Vossenberg; Ronald Gampp; Joerg Muchow; Franz Laermer; Stefan Finkbeiner

We developed a novel surface micromachining process to fabricate monocrystalline silicon membranes covering a vacuum cavity without any additional sealing steps. Heart of the process is anodic etching of porous silicon, annealing and epitaxial growth. The porous silicon layer consists of two parts, a starting mesoporous silicon layer with low surface porosity and a nanoporous silicon layer with a high porosity. The following annealing step removes native oxide within the later cavity, and the surface is sealed for the subsequent epitaxial layer deposition. The observed stacking fault density in the epitaxial layer about 1E5 cm-2. The temperature budget of the following ASIC-process leads to a complete transformation of the nanoporous silicon layer into a large cavity. The whole structure can be used as a pressure sensor. The estimated pressure in the cavity is smaller than 1 mbar. First integrated pressure sensors have been fabricated using this process. The sensors show a good linearity over the whole pressure range of 200 mbar to 1000 mbar. This novel process has several advantages compared to already published processes. It is a “MEMS first” process, which means that after the epitaxial growth the surface of the wafer is close to a standard wafer surface. Due to full IC compatibility, standard ASIC processes are possible after the fabrication of the membrane. The use of porous silicon enables a high degree of geometrical freedom in the design of membranes compared to standard bulk micromachining (KOH, TMAH). The monocrystalline membranes can be fabricated with surface micromachining without any additional sealing or backside processing steps.


symposium on design, test, integration and packaging of mems/moems | 2002

Influence of process variation on the functionality of a high-pressure sensor

Joerg Muchow; Andre Kretschmann; Ralf Henn; Klaus Skrobanek; Stefan Finkbeiner; Hans Reiner Krauss

A sensor designer has to keep in mind a couple of things developing a new product. These are performance, reliability and last but not least cost. Cost is mainly a function of yield. To be successful on the market, it is therefore necessary to predict yield for a new design, based on its process steps. This can be done only by modeling a sensor based on process parameters as input to the models. How to realize this, will be shown for the design of a high pressure sensor.


Archive | 1991

Microvalve of multilayer silicon construction

Christian Doering; Thomas Dipl Phys Dr Grauer; Michael Mettner; Armin Schuelke; Jiri Marek; Hans-Peter Trah; Joerg Muchow; Martin Willmann


Archive | 1995

Method of fabricating a micromechanical sensor

Joerg Muchow; Horst Muenzel; Michael Offenberg; Winfried Waldvogel


International Congress & Exposition | 1995

Integrated Silicon Pressure Sensor for Automotive Application with Electronic Trimming

H.-J. Kress; Jiri Marek; M. Mast; Oliver Schatz; Joerg Muchow


Archive | 2000

Micromechanical sensor and method for the manufacture thereof

Joerg Muchow; Horst Muenzel; Michael Offenberg; Winfried Waldvogel


Archive | 2007

Kraftstoffeinspritzsystem für brennkraftmaschinen

Joerg Muchow; Axel Kaschner; Axel Jasenek


Archive | 1993

Micromechanical sensor and method for its production

Joerg Muchow; Horst Muenzel; Michael Dr Ing Dr Offenberg; Winfried Waldvogel


Archive | 2008

Deviation device for a beam of an electromagnetic wave

Tjalf Pirk; Stefan Pinter; Hubert Benzel; Heribert Weber; Michael Krueger; Robert Sattler; Njimonzie Frederic Njikam; Joerg Muchow; Joachim Fritz; Christoph Schelling; Christoph Friese


Archive | 2006

Micromechanical sensor element

Joerg Muchow; Hubert Benzel; Simon Armbruster; Christoph Schelling

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