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Featured researches published by Jonathan H. Harris.


MRS Proceedings | 1993

The Oxygen-Related Defect in Aluminum Nitride Ceramics: a Thermal Conduction Limiting Defect in a Technologically Important Material

Jonathan H. Harris; Robert A. Youngman; Rudy Enck

Aluminum nitride (AlN) sintered ceramics are a critical new material for electronic packaging applications, principally because of AlNs high thermal conductivity and close thermal expansion match to silicon. AlN is expected to play a key role in the next generation of high powder electronic packages, in applications ranging from high power discrete component substrates to co-fired, multilayer packages for integrated circuits. In the following paper, a detailed picture of the oxygen-related defect in AlN ceramics is presented. This impurity is of critical technological importance, because vacancies associated with oxygen severely limit thermal conduction when present in high concentrations. The results of thermal conductivity measurements, luminescence studies, optical absorption experiments, photo-induced absorption studies and electrical measurements on both ceramic and single crystal samples will be presented in order to understand the detailed nature of this defect and to model its control over a number of important technological properties.


Journal of the American Ceramic Society | 1990

Luminescence Studies of Oxygen‐Related Defects In Aluminum Nitride

Robert A. Youngman; Jonathan H. Harris


Archive | 1995

Low temperature sintering route for aluminum nitride ceramics

Jonathan H. Harris; Subhash L. Shinde; Takeshi Takamori; Robert A. Youngman; Lester Wynn Herron; Benjamin V. Fasano


Archive | 1996

Aluminum nitride body having graded metallurgy

Jon A. Casey; Carla Natalia Cordero; Benjamin V. Fasano; David B. Goland; Robert Hannon; Jonathan H. Harris; Lester Wynn Herron; Gregory M. Johnson; Niranjan M. Patel; Andrew Michael Reitter; Subhash L. Shinde; Rao V. Vallabhaneni; Robert A. Youngman


Archive | 1996

Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck

Rudolph C. Enck; Jonathan H. Harris; Robert A. Youngman; Thomas S. Nemecek


Archive | 1995

Low temperature sintered, resistive aluminum nitride ceramics

Jonathan H. Harris; Robert A. Youngman; Subhash L. Shinde; Lester Wynn Herron; Benjamin V. Fasano


Archive | 1997

Controlled dielectric loss aluminum nitride

Rudolph C. Enck; Jonathan H. Harris; Robert A. Youngman; Thomas S. Nemecek


Archive | 2014

Thermocompression bonding apparatus and method

Stephen P. Nootens; Frank J. Polese; Christopher H. Bateman; Sorin Dinescu; Casey C. Clausen; William L. Bradbury; Donald M. Bechelder; Jonathan H. Harris; Robert J. Tesch


Archive | 2013

Transient liquid phase, pressureless joining of aluminum nitride components

Jonathan H. Harris; Frank J. Polese; Robert J. Tesch; Stephen P. Nootens; Sorin Dinescu; William L. Bradbury; Casey C. Clausen


Archive | 1998

Method of forming an aluminum nitride article utilizing a platinum catalyst

Jon A. Casey; Jonathan H. Harris; Lester Wynn Herron; Irvin Huseby; Richard A. Shelleman; Subhash L. Shinde; Robert A. Youngman

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