Joyce S. Oey Hewett | Researchain

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Featured researches published by Joyce S. Oey Hewett.

Archive | 2002

Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same

Joyce S. Oey Hewett; Anthony J. Toprac

Archive | 2001

Use of endpoint system to match individual processing stations wirhin a tool

Alexander J. Pasadyn; Joyce S. Oey Hewett

Archive | 2001

METHOD AND APPARATUS FOR CONTROLLING A TOOL USING A BASELINE CONTROL SCRIPT

Christopher A. Bode; Alexander J. Pasadyn; Anthony J. Toprac; Joyce S. Oey Hewett; Anastasia Oshelski Peterson; Thomas J. Sonderman; Michael L. Miller

Archive | 2001

Method and apparatus for adaptively scheduling tool maintenance

Anthony J. Toprac; Thomas J. Sonderman; Christopher A. Bode; Alexander J. Pasadyn; Joyce S. Oey Hewett; Anastasia Oshelski Peterson; Michael L. Miller

Archive | 2001

Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same

Joyce S. Oey Hewett; Alexander J. Pasadyn

Archive | 2001

Method of controlling chemical mechanical polishing operations to control erosion of insulating materials

Joyce S. Oey Hewett; Gerd Marxsen; Anthony J. Toprac

Archive | 2001

METHOD AND APPARATUS FOR INTEGRATING MULTIPLE PROCESS CONTROLLERS

Christopher A. Bode; Alexander J. Pasadyn; Anthony J. Toprac; Joyce S. Oey Hewett; Anastasia Oshelski Peterson; Thomas J. Sonderman; Michael L. Miller

Archive | 2001

Method for prioritizing production lots based on grade estimates and output requirements

Anthony J. Toprac; Joyce S. Oey Hewett; Christopher A. Bode; Alexander J. Pasadyn; Anastasia Oshelski Peterson; Thomas J. Sonderman; Michael L. Miller

Archive | 2001

Automated method of controlling critical dimensions of features by controlling stepper exposure dose, and system for accomplishing same

Joyce S. Oey Hewett; Alexander J. Pasadyn; Anthony J. Toprac

Archive | 2001

Method and apparatus for controlling the flow of wafers through a process flow

Alexander J. Pasadyn; Anthony J. Toprac; Christopher A. Bode; Joyce S. Oey Hewett; Anastasia Oshelski Peterson; Thomas J. Sonderman; Michael L. Miller

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