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Ju-Il Choi

Samsung

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Publication

Featured researches published by Ju-Il Choi.

Archive | 2008

Semiconductor Device and Method of Fabricating the Semiconductor Device

Se-young Jeong; Ho-geon Song; Ju-Il Choi; Jae-hyun Phee

Archive | 2008

Wafer-level stack package and method of fabricating the same

In-Young Lee; Ho-Jin Lee; Hyun-Soo Chung; Ju-Il Choi; Son-Kwan Hwang

Archive | 2008

Chip stack package and method of manufacturing the chip stack package

Cha-Jea Jo; Myung-Kee Chung; Nam-Seog Kim; In-Young Lee; Seok-Ho Kim; Ho-Jin Lee; Ju-Il Choi; Chang-Woo Shin

Archive | 2009

Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein and Chips Formed Thereby

Ho-Jin Lee; Kang-Wook Lee; Myeong-Soon Park; Ju-Il Choi; Son-Kwan Hwang

Archive | 2009

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Hyun-Soo Chung; Seung-Kwan Ryu; Ju-Il Choi; Dong-Ho Lee; Seong-Deok Hwang

Archive | 2011

Semiconductor devices having electrodes

Jae-hyun Phee; Uihyouong Lee; Ju-Il Choi; Jung-Hwan Kim

Archive | 2011

Semiconductor Devices Having Electrodes and Methods of Fabricating the Same

Jae-hyun Phee; Uihyouong Lee; Ju-Il Choi; Jung-Hwan Kim

Archive | 2011

Multi-Chip Package Having Semiconductor Chips Of Different Thicknesses From Each Other And Related Device

Keum-Hee Ma; Woo-dong Lee; Min-Seung Yoon; Ju-Il Choi; Sang-sick Park; Son-Kwan Hwang

Archive | 2010

Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein

Ho-Jin Lee; Kang-Wook Lee; Myeong-Soon Park; Ju-Il Choi; Son-Kwan Hwang

Archive | 2013

ELECTRICAL INTERCONNECTION STRUCTURES INCLUDING STRESS BUFFER LAYERS

Jeonggi Jin; Jeong-Woo Park; Ju-Il Choi

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Collaboration

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Ho-Jin Lee

Samsung

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Son-Kwan Hwang

Samsung

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Jae-hyun Phee

Samsung

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Jeong-Woo Park

Samsung

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Jeonggi Jin

Samsung

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Cha-Jea Jo

Samsung

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Hyun-Soo Chung

Samsung

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In-Young Lee

Samsung

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Kun-Sang Park

Samsung

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Myeong-Soon Park

Samsung

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