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Jeonggi Jin

Samsung

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Publication

Featured researches published by Jeonggi Jin.

Archive | 2013

ELECTRICAL INTERCONNECTION STRUCTURES INCLUDING STRESS BUFFER LAYERS

Jeonggi Jin; Jeong-Woo Park; Ju-Il Choi

Archive | 2014

Semiconductor device, semiconductor package, and electronic system

Jeonggi Jin; Ho-Joon Lee; Jiwoong Sue; Joo-Hee Jang

Archive | 2013

METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING BUMP

Son-Kwan Hwang; Jin-Ho Chun; Byung-lyul Park; Jeonggi Jin; Gil-heyun Choi

Archive | 2013

INTEGRATED CIRCUIT DEVICES INCLUDING THROUGH-SILICON-VIAS HAVING INTEGRAL CONTACT PADS

Jeonggi Jin; Jeong-Woo Park; Ju-Il Choi

Archive | 2013

Electrical Interconnections of Semiconductor Devices and Methods for Fabricating the Same

Ju-Il Choi; Jeong-Woo Park; Jeonggi Jin; Yeun-Sang Park

Archive | 2015

INTEGRATED CIRCUIT DEVICES HAVING THROUGH-SILICON VIAS AND METHODS OF MANUFACTURING SUCH DEVICES

Ju-Il Choi; Atsushi Fujisaki; Byung-lyul Park; Ji-soon Park; Joo-Hee Jang; Jeonggi Jin

Archive | 2014

Integrated Circuit Devices Including a Through-Silicon Via Structure and Methods of Fabricating the Same

Jae-hwa Park; Kwang-jin Moon; Suk-Chul Bang; Byung-Iyul Park; Jeonggi Jin; Tae-Seong Kim; Sung-Hee Kang

Archive | 2013

Semiconductor Chips and Semiconductor Packages and Methods of Fabricating the Same

Ju-Il Choi; Jeong-Woo Park; Jeonggi Jin; Hyung-Seok Kim

Archive | 2012

Joint Structures Having Organic Preservative Films

Ju-Il Choi; Jeonggi Jin; Ui-Hyoung Lee; Hyung-Seok Kim; Jeong-Woo Park

Archive | 2015

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES CAPPED WITH SELF-ALIGNED PROTECTION LAYERS AND METHODS FOR FABRICATING SAME

Jeonggi Jin; Byung Lyul Park; Ji-soon Park; Suk-Chul Bang; Deok-Young Jung

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Collaboration

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Ju-Il Choi

Samsung

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Jeong-Woo Park

Samsung

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Byung-lyul Park

Samsung

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Ji-soon Park

Samsung

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Suk-Chul Bang

Samsung

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Byung Lyul Park

Samsung

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Deok-Young Jung

Samsung

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Hyung-Seok Kim

Samsung

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Jin-Ho Chun

Samsung

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Joo-Hee Jang

Samsung

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