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Dive into the research topics where Son-Kwan Hwang is active.

Publication


Featured researches published by Son-Kwan Hwang.


Archive | 2009

WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

Hyun-Soo Chung; In-Young Lee; Son-Kwan Hwang; Dong-Ho Lee; Seong-Deok Hwang


Archive | 2008

Wafer-level stack package and method of fabricating the same

In-Young Lee; Ho-Jin Lee; Hyun-Soo Chung; Ju-Il Choi; Son-Kwan Hwang


Archive | 2009

Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein and Chips Formed Thereby

Ho-Jin Lee; Kang-Wook Lee; Myeong-Soon Park; Ju-Il Choi; Son-Kwan Hwang


Archive | 2008

Chip stack package and method of fabricating the same

Hyun-Soo Chung; Dong-Ho Lee; Nam-Seog Kim; Son-Kwan Hwang


Archive | 2009

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Ho-Jin Lee; Dong-Hyun Jang; In-Young Lee; Min-Seung Yoon; Son-Kwan Hwang


Archive | 2013

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Jin-Ho Chun; Byung-lyul Park; Hyun-Soo Chung; Gil-heyun Choi; Son-Kwan Hwang


Archive | 2009

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Son-Kwan Hwang; Keum-Hee Ma; Seung-woo Shin; Min-Seung Yoon; Jong-Ho Yun; Ui-Hyoung Lee


Archive | 2008

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Hyun-Soo Chung; Dong-Hyeon Jang; Son-Kwan Hwang; Nam-Seog Kim


Archive | 2011

Multi-Chip Package Having Semiconductor Chips Of Different Thicknesses From Each Other And Related Device

Keum-Hee Ma; Woo-dong Lee; Min-Seung Yoon; Ju-Il Choi; Sang-sick Park; Son-Kwan Hwang


Archive | 2010

Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein

Ho-Jin Lee; Kang-Wook Lee; Myeong-Soon Park; Ju-Il Choi; Son-Kwan Hwang

Collaboration


Dive into the Son-Kwan Hwang's collaboration.

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