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Chien Ling Hwang

TSMC

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Publication

Featured researches published by Chien Ling Hwang.

Archive | 2013

Fan-out interconnect structure and method for forming same

Chen-Hua Yu; Yen-Chang Hu; Ching-Wen Hsiao; Mirng-Ji Lii; Chung-Shi Liu; Chien Ling Hwang; Chih-Wei Lin; Chen-Shien Chen

Archive | 2011

COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION

Chien Ling Hwang; Zheng-Yi Lim; Chung-Shi Liu

Archive | 2012

Thermal Compressive Bonding with Separate Die-Attach and Reflow Processes

Chien Ling Hwang; Ying-Jui Huang; Cheng-Chung Lin; Chung-Shi Liu

Archive | 2010

PROTECTION LAYER FOR PREVENTING UBM LAYER FROM CHEMICAL ATTACK AND OXIDATION

Chung-Shi Liu; Chien Ling Hwang; Ming-Che Ho

Archive | 2014

Pillar Bumps and Process for Making Same

Cheng-Chung Lin; Chung-Shi Liu; Meng-Wei Chou; Kuo Cheng Lin; Wen-Hsiung Lu; Chien Ling Hwang; Ying-Jui Huang; De-Yuan Lu

Archive | 2011

Substrate Assembly Carrier Using Electrostatic Force

Yi-Li Hsiao; Chen-Hua Yu; Chung-Shi Liu; Chien Ling Hwang; Ying-Jui Huang

Archive | 2012

Copper pillar bump with non-metal sidewall protection structure and method of making the same

Yi-Wen Wu; Cheng-Chung Lin; Chien Ling Hwang; Chung-Shi Liu

Archive | 2010

Method of forming semiconductor die

Chien Ling Hwang; Ying-Jui Huang; Zheng-Yi Lim; Yi-Yang Lei; Cheng-Chung Lin; Chung-Shi Liu

Archive | 2010

Doping minor elements into metal bumps

Ming-Da Cheng; Ming-Che Ho; Chung-Shi Liu; Chien Ling Hwang; Cheng-Chung Lin; Hui-Jung Tsai; Zheng-Yi Lim

Archive | 2010

Thermal Compressive Bond Head

Chien Ling Hwang; Cheng-Chung Lin; Ying-Jui Huang; Chung-Shi Liu

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Collaboration

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Chung-Shi Liu

TSMC

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Yeong-Jyh Lin

TSMC

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Bor-Ping Jang

TSMC

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Chen-Hua Yu

TSMC

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Ming-Da Cheng

TSMC

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Yi-Li Hsiao

TSMC

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Cheng-Chung Lin

TSMC

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Ying-Jui Huang

TSMC

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Hsin-Hung Liao

TSMC

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Mirng-Ji Lii

TSMC

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