Kamil Gradkowski

Complex emission dynamics of type-II GaSb/GaAs quantum dots

Optical properties of the GaSb/GaAs quantum dot system are investigated using a time-resolved photoluminescence technique. In this type-II heterostructure the carriers of different species are spatially separated and, as a consequence, a smooth evolution of both the emission wavelength and decay timescale is observed. A wavelength shift of 170 nm is measured simultaneously with the progressive timescale change from 100 ps to 23 ns. These phenomena are explained by the evolution of the carrier density, which brings a modification to the optical transition probability as well as the shift in the emission toward the higher energies.

Band Alignment Tailoring of InAs1-xSbx/GaAs Quantum Dots: Control of Type I to Type II Transition

We report the growth of InAs(1-x)Sb(x) self-assembled quantum dots (QDs) on GaAs (100) by molecular beam epitaxy. The optical properties of the QDs are investigated by photoluminescence (PL) and time-resolved photoluminescence (TRPL). A type I to type II band alignment transition is demonstrated by both power-dependent PL and TRPL in InAs(1-x)Sb(x) QD samples with increased Sb beam flux. Results are compared to an eight-band strain-dependent k x p model incorporating detailed QD structure and alloy composition. The calculations show that the conduction band offset of InAs(1-x)Sb(x)/GaAs can be continuously tuned from 0 to 500 meV and a flat conduction band alignment exists when 60% Sb is incorporated into the QDs. Our study offers the possibility of tailoring the band structure of GaAs based InAsSb QDs and opens up new means for device applications.

Competitive carrier interactions influencing the emission dynamics of GaAsSb-capped InAs quantum dots

The optical properties of InAs/GaAs quantum dots capped with a GaAsSb quantum well are investigated by means of power-dependent and time-resolved photoluminescence. The structure exhibits the coexistence of a type-I ground state and few type-II excited states, the latter characterized by a simultaneous carrier density shift of the peak position and wavelength-dependent carrier lifetimes. Complex emission dynamics are observed under a high-power excitation regime, with the different states undergoing shifts during specific phases of the measurement. These features are satisfactorily explained in terms of band structure and energy level modifications induced by two competitive carrier interactions inside the structure.

Crystal defect topography of Stranski–Krastanow quantum dots by atomic force microscopy

We demonstrate a technique to monitor the defect density in capped quantum dot (QD) structures by performing an atomic force microscopy (AFM) of the final surface. Using this method we are able to correlate their density with the optical properties of the dot structures grown at different temperatures. Parallel transmission electron microscopy analysis shows that the AFM features are directly correlated with the density of stacking faults that originate from abnormally large dots. The technique is rapid and noninvasive making it an ideal diagnostic tool for optimizing the parameters of practical QD-based devices.

Improved room-temperature luminescence of core-shell InGaAs/GaAs nanopillars via lattice-matched passivation

Optical properties of GaAs/InGaAs/GaAs nanopillars (NPs) grown on GaAs(111)B were investigated. Employment of a mask-etching technique allowed for an accurate control over the geometry of NP arrays in terms of both their diameter and separation. This work describes both the steady-state and time-resolved photoluminescence of these structures as a function of the ensemble geometry, composition of the insert, and various shell compounds. The effects of the NP geometry on a parasitic radiative recombination channel, originating from an overgrown lateral sidewall layer, are discussed. Optical characterization reveals a profound influence of the core-shell lattice mismatch on the carrier lifetime and emission quenching at room temperature. When the lattice-matching conditions are satisfied, an efficient emission from the NP arrays at room temperature and below the band-gap of silicon is observed, clearly highlighting their potential application as emitters in optical interconnects integrated with silicon platf...

Wettability and “petal effect” of GaAs native oxides

We discuss unreported transitions of oxidized GaAs surfaces between (super)hydrophilic and hydrophobic states when stored in ambient conditions. Contact angles higher than 90° and high adhesive force were observed for several air-aged epitaxial samples grown under different conditions as well as on epi-ready wafers. Regardless of the morphologies of the surface, superhydrophilicity of oxygen-plasma treated samples was observed, an effect disappearing with storage time. Reproducible hydrophobicity was likewise observed, as expected, after standard HCl surface etching. The relation between surface oxides and hydrophobic/hydrophilic behavior is discussed.

Thermal challenges for packaging integrated photonic devices

In this work, we present thermal imaging and analysis of a silicon photonic optical network unit (ONU) for next generation passive optical networks (NG-PONs). A high-speed thermal camera is used to capture both the dynamic and steady-state temperatures of the photonic integrated circuit (PIC) and electric integrated circuit (EIC) at the core of the ONU. The dynamic temperature measurements of the PIC and EIC on powering-up the ONU show several distinct “steps” before the steady-state temperature is reached, and we show that these features can be predicted and fitted using a simple lumped-element rate-equation model. Steady-state temperature measurements made by mounting the ONU module on a thermally-stabilized stage allow the coefficient of performance (COP) of the thermoelectric cooler (TEC) in the module to be evaluated for simulated ambient temperatures ranging from 15-45 °C. This provides valuable information on the operational cost of the ONU in the field, where temperature-stabilization of the PIC represents a significant fraction of the overall power-budget.

Ultrafast dynamics of type-II GaSb/GaAs quantum dots

In this paper, room temperature two-colour pump-probe spectroscopy is employed to study ultrafast carrier dynamics in type-II GaSb/GaAs quantum dots. Our results demonstrate a strong dependency of carrier capture/escape processes on applied reverse bias voltage, probing wavelength and number of injected carriers. The extracted timescales as a function of both forward and reverse bias may provide important information for the design of efficient solar cells and quantum dot memories based on this material. The first few picoseconds of the dynamics reveal a complex behaviour with an interesting feature, which does not appear in devices based on type-I materials, and hence is linked to the unique carrier capture/escape processes possible in type-II structures.

Coulomb effect inhibiting spontaneous emission in charged quantum dot

We investigate the emission dynamics of InAs/GaAs quantum dots (QDs) coupled to an InGaAs quantum well in a tunnel injection scheme by means of time-resolved photoluminescence. Under high-power excitation we observe a redshift in the QD emission of the order of 20 meV. The optical transition intensity shows a complex evolution, where an initial plateau phase is followed by an increase in intensity before a single-exponential decay. We attribute this behavior to the Coulomb interactions between the carriers in a charged QD and corroborate the experimental results with both a rate equation model and self-consistent eight-band k⋅p calculations.

Packaging of silicon photonic devices: from prototypes to production

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.