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Japanese Journal of Applied Physics | 2005

Slip Generation in Si Wafers due to Friction-Induced Stress and Its Suppression Technique

Iwao Nakamura; Ryota Sasajima; Keishin Yamazaki; Naoto Nakamura; Sadao Nakashima

Slip-free 300 mm wafers annealed at temperatures higher than 1000°C have been investigated. It has been found that friction-related stress must be introduced to explain slip generation experimentally in addition to gravitationally induced bending stress, compressive stress and thermally induced stress. Slip-free 300 mm wafers annealed at 1350°C are obtained by appropriately controlling the surface roughness of the supporting disk.


Archive | 2011

Heat treatment apparatus and method of manufacturing semiconductor device

Keishin Yamazaki; Akira Hayashida; Masaaki Ueno; Manabu Izumi; Katsuaki Nogami


Archive | 2005

Heat Treatment Apparatus and Method of Manufacturing Substrates

Tomoharu Shimada; Akira Morohashi; Kojiro Yokozawa; Keishin Yamazaki


Archive | 2015

Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium

Hideto Tateno; Yuichi Wada; Hiroshi Ashihara; Keishin Yamazaki; Takurou Ushida; Iwao Nakamura; Manabu Izumi


Archive | 2005

Heat treatment apparatus and substrate manufacturing method

Tomoharu Shimada; Akira Morohashi; Keishin Yamazaki; Kojiro Yokozawa


Archive | 2006

Substrate treatment apparatus, method for manufacturing substrate, and method for manufacturing semiconductor device

Keishin Yamazaki; Iwao Nakamura; Ryota Sasajima


Archive | 2010

Substrate processing apparatus having covered thermocouple for enhanced temperature control

Keishin Yamazaki; Iwao Nakamura; Ryota Sasajima


Archive | 2006

Heat-treating apparatus and method of producing substrates

Akira Morohashi; Iwao Nakamura; Ryota Sasajima; Keishin Yamazaki; Sadao Nakashima


Archive | 2015

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND FURNACE LID

Keishin Yamazaki; Manabu Izumi; Katsuaki Nogami


Archive | 2017

SUBSTRATE TREATMENT APPARATUS, REACTION TUBE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Keishin Yamazaki; Satoru Murata; Shinya Morita

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