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Dive into the research topics where Kesahiro Koike is active.

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Featured researches published by Kesahiro Koike.


Proceedings of SPIE, the International Society for Optical Engineering | 2007

Recent performance of EUV mask blanks with low-thermal expansion glass substrates

Tsutomu Shoki; Takeyuki Yamada; Shouji Shimojima; Yuuki Shiota; Mitsuharu Tsukahara; Kesahiro Koike; Hiroaki Shishido; Osamu Nozawa; Toshiyuki Sakamoto; Morio Hosoya

A high flatness of 50 nm, zero defects at more than a size of 30 nm and a high reflectivity of more than 66% for extreme ultraviolet (EUV) light are critical issues related to EUV mask blanks. In this paper, progress on these issues and the recent performance of EUV blanks is reported. Steady progress in defect reduction was achieved in the past six years by improving fabrication processes. When inspected by a Lasertec M1350, defect quality as low as 0.02 defects/cm2 at 70-nm sensitivity was demonstrated on a multilayer (ML) blank with a quartz (QZ) substrate. A QZ substrate with a high flatness of around 90 nm peak-to-valley (P-V) on both sides and a high defect quality of 0.006 defects/cm2 at 60-nm sensitivity was obtained using a newly developed polishing process consisting of local polishing, touch polishing and cleaning. The cleaning process was developed for low thermal expansion (LTE) glass to reduce the defects associated with it. Using the cleaning process, the ULETM substrates showed defectivity similar to the QZ substrates. An average flatness of 117 nm P-V, and best flatness of 84 nm P-V on the front side and 56 nm P-V on the back side were obtained on ULE substrates using the new polishing process. Multilayer (ML) blanks with a high defect quality of 0.08 defects/cm2 at 80-nm sensitivity were produced on a ULE substrate. The ML blanks, consisting of 50 bilayers, have high peak reflectivity of more than 66% and excellent uniformity of less than 0.04 nm in centroid wavelength, which meets the desired specifications.


Archive | 2005

Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus

Kesahiro Koike; Masato Ohtsuka; Yasutaka Tochihara


Archive | 2004

Method of producing a glass substrate for a mask blank and method of producing a mask blank

Kesahiro Koike


Archive | 2003

SUBSTRATE FOR ELECTRONIC DEVICE, MASK BLANK USING THE SAME, MASK FOR TRANSFER, METHOD FOR PRODUCING THESE, POLISHING APPARATUS AND POLISHING METHOD

Kesahiro Koike; Masahito Otsuka; Yasutaka Tochihara; 大塚 聖人; 小池 今朝広; 栃原 康孝


Archive | 2003

Processes for production of glass substrate for mask blank, mask blank, transfer mask, semiconductor device, glass substrate for mask blank, mask blank and transfer mask

Kesahiro Koike; Junji Miyagaki; 宮垣 淳二; 小池 今朝広


Archive | 2008

Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask

Kesahiro Koike; Junji Miyagaki


Archive | 2003

Method of producing a glass substrate for a mask blank, method of producing a mask blank, method of producing a transfer mask, method of producing a semiconductor device, glass substrate for a mask blank, mask blank, and transfer mask

Kesahiro Koike; Junji Miyagaki


Archive | 2006

Transparent substrate for mask blank and mask blank

Kesahiro Koike; Osamu Suzuki; Akihiro Kawahara


Archive | 2005

Manufacturing method for mask blank substrate, mask blank and transfer mask

Kesahiro Koike; Masahito Otsuka; Yasutaka Tochihara; 聖人 大塚; 今朝広 小池; 康孝 栃原


Archive | 2005

Glass substrate for mask blank, mask blank, method for producing glass substrate for mask blank, and polishing device

Kesahiro Koike; Yasutaka Tochihara; 今朝広 小池; 康孝 栃原

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