Kimin Jun

MONOLITHIC THREE-DIMENSIONAL (3D) ICs WITH LOCAL INTER-LEVEL INTERCONNECTS

HETEROGENEOUS SEMICONDUCTOR MATERIAL INTEGRATION TECHNIQUES

Liquid metal interconnects

Multi-gate high electron mobility transistors and methods of fabrication

METHOD FOR DIRECT INTEGRATION OF MEMORY DIE TO LOGIC DIE WITHOUT USE OF THRU SILICON VIAS (TSV)

Embedded memory in interconnect stack on silicon die

METHODS OF FORMING BURIED VERTICAL CAPACITORS AND STRUCTURES FORMED THEREBY

Heterogeneous layer device

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED FABRICATION TECHNIQUES

HIGH ELECTRON MOBILITY TRANSISTOR FABRICATION PROCESS ON REVERSE POLARIZED SUBSTRATE BY LAYER TRANSFER