Kouichi Tsuyama | Researchain

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Archive | 1997

Process for producing multilayer printed circuit board for wire bonding

Naoyuki Urasaki; Kouichi Tsuyama; Kazuhito Kobayashi; Norio Okano; Hiroshi Shimizu; Nobuyuki Ogawa; Akishi Nakaso; Toyoki Ito; Daisuke Fujimoto; Kazuhisa Otsuka; Shigeharu Arike; Yoshiyuki Tsuru

Archive | 1997

Electrostatic protective device and method for fabricating same

Kouichi Tsuyama; Atsushi Suzunaga; Atsushi Nishimura; Tadashi Isono

Archive | 1994

Metal foil for printed wiring board and production thereof

Naoyuki Urasaki; Kouichi Tsuyama; Kiyoshi Hasegawa; Shuichi Hatakeyama; Akinari Kida; Akishi Nakaso; Hiroshi Nomura

Archive | 1996

Electrostatic protective device

Kouichi Tsuyama; Atsushi Suzunaga; Atsushi Nishimura; Tadashi Isono

Archive | 1993

Printed wiring board and production thereof

Akishi Nakaso; Kouichi Tsuyama; Akinari Kida; Shuichi Hatakeyama; Naoyuki Urasaki

Archive | 2007

Engraved plate and base material having conductor layer pattern using the engraved plate

Susumu Naoyuki; Hisashige Kanbara; Minoru Tosaka; Kyosuke Suzuki; Toshirou Okamura; Yoshihito Kikuhara; Masami Negishi; Tadayasu Fujieda; Kouichi Tsuyama

Archive | 2007

Engraved plate and substrate with conductor layer pattern using the same

Susumu Naoyuki; Hisashige Kanbara; Minoru Tosaka; Kyosuke Suzuki; Toshirou Okamura; Yoshihito Kikuhara; Masami Negishi; Tadayasu Fujieda; Kouichi Tsuyama

Archive | 1995