Laura M. Matz

Plasma treatment and repair processes for reducing sidewall damage in low-k dielectrics

Extraction of impurities in a semiconductor process with a supercritical fluid

Silicon nitride/oxygen doped silicon carbide etch stop bi-layer for improved interconnect reliability

Hydrogen and oxygen based photoresist removal process

METHOD FOR PREVENTION OF RESIST POISONING IN INTEGRATED CIRCUIT FABRICATION

FORMATION OF A SILICON OXIDE INTERFACE LAYER DURING SILICON CARBIDE ETCH STOP DEPOSITION TO PROMOTE BETTER DIELECTRIC STACK ADHESION

Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene Integration

SEMICONDUCTIVE DEVICE HAVING RESIST POISON ALUMINUM OXIDE BARRIER AND METHOD OF MANUFACTURE

Energy beam treatment to improve the hermeticity of a hermetic layer

MONITORING OF TEMPERATURE VARIATION ACROSS WAFERS DURING PROCESSING