Li-Chi Chang

A high isolation dual strip monopole antenna

A dual strip monopole antenna for 2×2 MIMO application is designed using an open strip stub and a parasitic strip, which are respectively employed for band stop filter and pattern diversity. The antenna satisfies the bandwidth requirement of 200 MHz (2.5 to 2.7 GHz) in IEEE 802.16 WiMAX standards, and the in-band isolation between the two monopoles is higher than 20 dB. The proposed design is successfully integrated with SiP (System in Package) and embedded passive components. After system verification, the measured EVM of the WiMAX system is below -30 dB at a 3m distance.

Design and implementation of mobile communications SiP modules with embedded components in multilayer organic hybrid substrate

In recent years, fashion mobile phones and other portable electronic products constantly challenge extreme slim design and then they stimulate a rapid development for SiP (system in package) technology. Traditional SMT (Surface Mount Technology) approaches to design and manufacture modules that are still too large. The SOC may reach the demand of miniaturization, but it is still technically difficult to overcome. SiP technology becomes a major consideration and selection of the miniaturized wireless broadband communication technologies. It has been widely applied on Bluetooth, WiFi, and so on. This paper uses SiP technology to realize 3.5G mobile communications modules in multilayer organic hybrid substrate.

Design and implementation of ultra-thin SiP modules

In recent years, SiP (System-in-Package) or SOP (System on Package) technology has become an attractive solution for size reduction of mobile devices. Passive components such as inductors or capacitors can be integrated into the substrate. The dimension of embedded capacitors can be further reduced by using high dielectric constant material. Thus, size miniaturization and cost reduction can be easily achieved through the replacements of surface-mounted devices (SMDs) on the substrate.chip can be reduced. Wafer-level packaging technology, wafer thinning technology, buried ultra-thin chips technology, and embedded passive components technology are both integrated in this paper to achieve a miniaturized ultra-thin SiP module. The feasibility of the ultra-thin SiP technology was verified by using a GPS module. For high integration and flexible design, an eight-layered organic substrate process is used in this project.

The database of Embedded Passives for RF-SiP design

Embedded Passives (EPs) are considered an attractive option to design RF-SiP (System in Package) modules. EPs are benefit by the shortened interconnections between active or passive components, which can make better RF-SiP modules. In this paper, we propose the database of EPs for RF-SiP design. The database provides the corresponding parameters of EPs, such as electrical characteristics, structures and material properties. The well-arranged database can help users to make the optimal design of EPs. Then the database of EPs was implemented to design the matching circuit of a power amplifier. The feasibility of the database has been proved via this case.