Li-Wen Hung | Researchain

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Featured researches published by Li-Wen Hung.

electronic components and technology conference | 2016

Feasibility Study of Si Handler Debonding by Laser Release

Bing Dang; Tom Wassick; Yang Liu; Qianwen Chen; Paul S. Andry; Li-Wen Hung; Hongqing Zhang; Jeffrey D. Gelorme; John U. Knickerbocker

This paper reports on a feasibility study of using infrared (IR) laser ablation for silicon handler debonding for the first time. Various lasers were evaluated for the transmission through a Si handler and several release layers were studied for on low-power laser ablation. Debonding of silicon handler has been successfully demonstrated. Furthermore, a test vehicle based on through-silicon-via (TSV) wafers was used to evaluate the impact of IR laser ablation on the devices. Promising electrical testing results are obtained and fast debonding at wafer level has been demonstrated.

Archive | 2016

LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING

Robert D. Allen; Paul S. Andry; Jeffrey D. Gelorme; Li-Wen Hung; John U. Knickerbocker; Cornelia K. Tsang

Archive | 2016

Double Layer Release Temporary Bond and Debond Processes and Systems

Paul S. Andry; Russell A. Budd; Bing Dang; Li-Wen Hung; John U. Knickerbocker; Cornelia K. Tsang

electronic components and technology conference | 2018

Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions

John U. Knickerbocker; Russell A. Budd; Bing Dang; Qianwen Chen; Evan G. Colgan; Li-Wen Hung; Shriya Kumar; Kang-Wook Lee; Minhua Lu; Jae-Woong Nah; R. Narayanan; Katsuyuki Sakuma; V. Siu; B. Wen

electronic components and technology conference | 2018