Mahesh K. Shah

Plastic packaged device with die interface layer

Semiconductor device with a buffer region with tightly-packed filler particles

Semiconductor device with reduced package cross-talk and loss

HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS

SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, AND PACKAGING TECHNIQUES FOR IMPEDANCE MATCHING AND/OR LOW FREQUENCY TERMINATIONS

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Chemical die singulation technique

Solder wettable flanges and devices and systems incorporating solder wettable flanges

Semiconductor device with improved encapsulation

Semiconductor package with isolation wall