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Publication


Featured researches published by Mamoru Sawahata.


Japanese Journal of Applied Physics | 2002

The Low Temperature Bonding between Si and Electrode Using Sputtered Ag Films

Jin Onuki; Mitsuo Katou; Mamoru Sawahata; Takao Komiyama; Yasunori Chonan

A low temperature Joining process using sputtered Ag films has been investigated. The surfaces of Ag films were cleaned by heating them to more than 523 K in air. After cleaning, the Si chip and the Mo can be joined using a Ag film under joining conditions as: temperature 503 K; compressive stress: 60 MPa; holding time: 0.5 h; atmosphere: air. A diode made with this low temperature joining process using Ag film exhibits an excellent low leakage current–voltage characteristics.


Archive | 1986

Semiconductor resin package structure

Tasao Soga; Marahiro Goda; Fumio Nakano; Tadao Kushima; Nobuyuki Ushifusa; Fumiyuki Kobayashi; Mamoru Sawahata


Archive | 1993

Method and apparatus for removing an electronic component from a board

Hirokazu Inoue; Masahiro Takasaka; Koichi Watanabe; Takashi Hosokawa; Mamoru Sawahata


Archive | 1992

Electronic parts loaded module including thermal stress absorbing projecting electrodes

Takashi Hosokawa; Hirokazu Inoue; Mamoru Sawahata; Masaki Fukuoka


Archive | 1999

Press contact type semiconductor device and converter using same

Hironori Kodama; Mitsuo Katou; Mamoru Sawahata


Archive | 2002

Semiconductor device, including an arrangement to provide a uniform press contact and converter using same

Hironori Kodama; Mitsuo Katou; Mamoru Sawahata


Archive | 1995

Semiconductor device having power semiconductor elements

Kazuji Yamada; Akira Tanaka; Ryuichi Saito; Yasutoshi Kurihara; Tadao Kushima; Takashi Haramaki; Yoshihiko Koike; Takashi Hosokawa; Mamoru Sawahata; Masahiro Koizumi; Jin Onuki; Kazuhiro Suzuki; Isao Kobayashi; Hideo Shimizu; Yutaka Higashimura; Shigeki Sekine; Nobuya Koike; Hideya Kokubun


Archive | 1982

Connecting structure of board

Tasao Soga; Takaya Suzuki; Mamoru Sawahata; Tadao Kushima


Archive | 1992

Electronic parts loaded module

Takashi Hosokawa; Hirokazu Inoue; Mamoru Sawahata; Masaki Fukuoka


Archive | 1986

Structure for semiconductor package

Hiroshi Honjo; Koichi Inoue; Mamoru Sawahata; Tasao Soga; Komei Yatsuno

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