Maria Anna Rzeznik

Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating

A novel DC through hole filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range.

Next generation Copper electroplating for HDI micro-via filling and through hole plating

A novel DC blind micro via filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range. The process will be commercialized and it is anticipated that there will be substantial future growth in adoption of this technology to fill blind micro vias. This new chemistry in combination with optimized plating conditions and plating equipment can fill blind micro vias of various geometries. The plated copper has excellent physical and mechanical properties with a mirror bright surface. This formulation is intended to be used with either vertical or horizontal in-line jet impingement equipment in both panel and pattern modes. All organic additives can be easily monitored and controlled by conventional CVS analysis techniques.

Next generation electrolytic copper plating process for HDI applications

Copper electroplating is a critical step in the fabrication of reliable High Density Interconnect (HDI) substrates intended for use as core layers in build-up applications. HDI substrates may contain vias and through holes having several different dimensions that make it challenging to meet via filling and hole throwing power (TP) requirements. A next generation Electrolytic Copper plating process was developed to fill blind micro vias and provide good TP in through holes to meet the demands of this market. Void-free bottom-up fill in via features with higher throwing power in through holes is achieved with this novel Direct Current (DC) copper electroplating product. The copper via fill plating bath is formulated with novel additives to operate over a wide range of operating conditions.

CIRCUPOSIT™ 6530 catalyst process for electroless copper metallization

This paper describes the development of a new ionic palladium catalyst, CIRCUPOSIT™6530 Catalyst, along with a tartrate-based horizontal electroless copper bath, CIRCUPOSIT™6550, to meet the performance demands of high-density-interconnect (HDI) and packaging (PKG) substrates in horizontal electroless copper plating. Implementation of the new ionic catalyst process is demonstrated through excellent coverage and reliability performance of through holes and microvias on HDI and PKG substrates following processing in horizontal equipment, as well as peel strength on low profile dielectric materials in the semi-additive process. Results also showed that the new CIRCUPOSIT™6530 Catalyst demonstrated stable performance during customer qualification.