Markus Fink

Embedded wafer level ball grid array (eWLB) technology for system integration

Silicon front-end and assembly and packaging technology more and more merge. In addition interconnect density reaches limits for advanced CMOS technology. In this paper we introduce the fan-out embedded wafer level packaging technology, which is an example to link front-end and packaging technology and offers additional freedom for interconnect design. We demonstrate capabilites for system integration of the eWLB technology, which includes system on chip (SoC) integration and system in package (SiP) integration like side by side and stacking of devices. We highlight the importance of understanding properties of new materials, which influence warpage or heat dissipation. We also show the excellent performance of the eWLB package for mm-wave applications.

Simulation-based analysis of the Heat-Affected Zone during target preparation by pulsed- laser ablation through stacked silicon dies in 3D integrated System-in-Packages

The trends of 3D integration and System-in-Package (SiP) require the adaptation of target preparation methods for failure analysis of these complex integrated devices. Recent improvements in laser-based target preparation make laser cross-sections through several stacked silicon dies possible with remarkably small visible Heat-Affected Zones (HAZs). The distinct removal of Molding Compound (MC), silicon dies, and metal interconnects with a single laser source was demonstrated.

Virtual prototyping methodology for assessment of the interaction between wire bond pad design and bond process parameters to enhance the robustness of copper wire bond interconnect

Wire bond interconnection still remains to be one of the most important fields of study in IC packaging development. The robustness of the interconnection between the bond wire and the bond pad are highly dependent on several key factors, mainly: 1) bond pad design, 2) capillary design, and 3) wire bond profile. Consequently, these factors also affect the package quality and reliability. Destructive test methods such as bond pull test and bond shear test are commonly used for Process Control to evaluate the interfacial strength between the bond wire and bond pad. However, these types of destructive test methods provide little or no insight about how the interaction of the aforementioned factors might affect the under-pad layers susceptibility to damage.