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Masato Toshima

Applied Materials

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Publication

Featured researches published by Masato Toshima.

Archive | 1989

Multi-chamber integrated process system

Dan Maydan; Sasson Somekh; David Nin-Kou Wang; David Cheng; Masato Toshima; Isaac Harari; Peter D Hoppe

Archive | 1993

Silicon scavenger in an inductively coupled RF plasma reactor

Kenneth S. Collins; Craig A. Roderick; John Trow; Chan-Lon Yang; Jerry Y. Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; D. Pinson Ii Jay; Tetsuya Ishikawa; Lawrence C. Lei; Masato Toshima; Gerald Zheyao Yin

Archive | 1992

Plasma processing reactor and process for plasma etching.

Kenneth S. Collins; Craig A. Roderick; John Trow; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; Ii Jay D Pinson; Tetsuya Ishikawa; Lawrence Chung-Lai Lei; Masato Toshima

Archive | 2002

Dual cassette load lock

Masato Toshima; Phil Salzman; Steven Murdoch; Cheng Wang; Mark A Stenholm; James Howard; Leonard Hall; David Cheng

Archive | 1987

Vacuum chamber slit valve

Masato Toshima

Archive | 2000

Plasma reactor using inductive RF coupling, and processes

Kenneth S. Collins; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; Craig A. Roderick; John Trow; Tetsuya Ishikawa; D. Pinson Ii Jay; Lawrence Chang-Lai Lei; Masato Toshima; Gerald Zheyao Yin

Archive | 1993

Process used in an RF coupled plasma reactor

Kenneth S. Collins; Craig A. Roderick; John Trow; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; D. Pinson Ii Jay; Tetsuya Ishikawa; Lawrence Chang-Lai Lei; Masato Toshima

Archive | 1999

PROCESSES USED IN AN INDUCTIVELY COUPLED PLASMA REACTOR

Kenneth S. Collins; Craig A. Roderick; John Trow; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; Jay D. Pinson; Tetsuya Ishikawa; Lawrence Chang-Lai Lei; Masato Toshima

Archive | 2000

Magnetic confinement in a plasma reactor having an RF bias electrode

Kenneth S. Collins; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; Craig A. Roderick; John Trow; Tetsuya Ishikawa; D. Pinson Ii Jay; Lawrence Chang-Lai Lei; Masato Toshima; Gerald Zheyao Yin

Archive | 1997

Plasma etch processes

Kenneth S. Collins; Craig A. Roderick; John Trow; Chan-Lon Yang; Jerry Yuen-Kui Wong; Jeffrey Marks; Peter R. Keswick; David W. Groechel; D. Pinson Ii Jay; Tetsuya Ishikawa; Lawrence Chang-Lai Lei; Masato Toshima; Gerald Zheyao Yin

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Collaboration

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Kenneth S. Collins

Applied Materials

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Tetsuya Ishikawa

Applied Materials

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David Cheng

Applied Materials

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David W. Groechel

Applied Materials

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Chan-Lon Yang

Applied Materials

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Craig A. Roderick

Applied Materials

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Jeffrey Marks

Applied Materials

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John Trow

Applied Materials

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Peter R. Keswick

Applied Materials

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Jerry Yuen-Kui Wong

Applied Materials

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