Michael B. Ball

Multi-chip stacked devices

Multichip module having a stacked chip arrangement

Combination of semiconductor interconnect

Method of fabrication of stacked semiconductor devices

Multi-chip device and method of fabrication employing leads over and under processes

Angularly offset stacked die multichip device and method of manufacture

Multi-chip device utilizing a flip chip and wire bond assembly

Method of locating conductive spheres utilizing screen and hopper of solder balls

Method and apparatus for grinding wafers

Die interconnections using intermediate connection elements secured to the die face