Rich Fogal

Multichip module having a stacked chip arrangement

Angularly offset stacked die multichip device and method of manufacture

Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape

Angularly offset and recessed stacked die multichip device

Wire bonders and methods of wire-bonding

Method and apparatus for wire bonding semiconductor dice to a leadframe

Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape

Angularly offset and recessed stacked die multichip device and method of manufacture

Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

Condensed memory matrix