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Rich Fogal

Micron Technology

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Publication

Featured researches published by Rich Fogal.

Archive | 1993

Multichip module having a stacked chip arrangement

Rich Fogal; Michael B. Ball

Archive | 1998

Angularly offset stacked die multichip device and method of manufacture

Rich Fogal; Michael B. Ball

Archive | 1991

Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape

Rich Fogal; Jerrold L. King; Walter L. Moden

Archive | 1997

Angularly offset and recessed stacked die multichip device

Rich Fogal; Michael B. Ball

Archive | 2007

Wire bonders and methods of wire-bonding

Stuart L. Roberts; Rich Fogal

Archive | 1993

Method and apparatus for wire bonding semiconductor dice to a leadframe

Rich Fogal; Chender Huang; Mike Ball

Archive | 1990

Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape

Rich Fogal; Jerrold L. King; Walter L. Moden

Archive | 1999

Angularly offset and recessed stacked die multichip device and method of manufacture

Rich Fogal; Michael B. Ball

Archive | 2002

Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

Michael B. Ball; Rich Fogal

Archive | 2001

Condensed memory matrix

Rich Fogal; Alan G. Wood

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Collaboration

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Michael B. Ball

Micron Technology

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Jerrold L. King

Micron Technology

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Steve W. Heppler

Micron Technology

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Stuart L. Roberts

Micron Technology

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Tracy V. Reynolds

Micron Technology

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Walter L. Moden

Micron Technology

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Alan G. Wood

Micron Technology

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Chad A. Cobbley

Micron Technology

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Chender Huang

Micron Technology

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John VanNortwick

Micron Technology

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