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Michael J. Berman

LSI Corporation

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Publication

Featured researches published by Michael J. Berman.

Archive | 1997

Use of ethylene glycol as a corrosion inhibitor during cleaning after metal chemical mechanical polishing

Michael J. Berman; Jayashree Kalpathy-Cramer

Archive | 1997

Chemical mechanical polishing pad slurry distribution grooves

Michael J. Berman; Jayashree Kalpathy-Cramer

Archive | 1999

Conditioning CMP polishing pad using a high pressure fluid

Michael J. Berman

Archive | 2002

Method and apparatus for cleaning deposited films from the edge of a wafer

Michael J. Berman; Steven E. Reder; Rennie G. Barber

Archive | 1997

Method for determining optical constants prior to film processing to be used improve accuracy of post-processing thickness measurements

Michael J. Berman; Jayashree Kalpathy-Cramer; Eric J. Kirchner; Thomas Frederick Allen Bibby

Archive | 1997

Automated endpoint detection system during chemical-mechanical polishing

Michael J. Berman

Archive | 2002

System and method for using film deposition techniques to provide an antenna within an integrated circuit package

Michael J. Berman; Rennie G. Barber

Archive | 2001

System and method for optimizing the electrostatic removal of a workpiece from a chuck

Michael J. Berman; Rennie G. Barber

Archive | 2004

Pad conditioning monitor

Michael J. Berman

Archive | 2003

Method to use a laser to perform the edge clean operation on a semiconductor wafer

Steven E. Reder; Michael J. Berman; Rennie G. Barber

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Steven E. Reder

LSI Corporation

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Rennie G. Barber

LSI Corporation

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George E. Bailey

LSI Corporation

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Jayashree Kalpathy-Cramer

Harvard University

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Bruce Whitefield

LSI Corporation

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Eric J. Kirchner

LSI Corporation

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Matthew R. Trattles

LSI Corporation

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Aftab Ahmad

LSI Corporation

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Brad Todd

Veeco

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Chok J. Chia

LSI Corporation

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