Michael L. McSwiney

Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics

This study investigated the origin of dielectric loss induced by O2 plasma on organo-silicate glass low-k dielectrics. The contributions from the polarization components to dielectric constant were delineated by analyzing the results from capacitance-voltage measurement, spectroscopic ellipsometry, and Fourier transform infrared spectroscopy together with the Kramers–Kronig dispersion relation. The dielectric loss was found to be dominated by the dipole contribution, compared with the electronic and ionic polarizations. The origin of the dipole contribution was further investigated by performing quantum chemistry calculations. The physisorbed water molecules were found to be primarily responsible for the dipole moment increase and the dielectric loss.

Dielectric Recovery of Plasma Damaged Organosilicate Low-k Films

Methyl depletion and subsequent moisture uptake have been found to be the primary plasma damages leading to dielectric loss in porous organosilicate (OSG) low-k dielectrics. A vacuum vapor silylation process was developed for dielectric recovery of plasma damaged OSG low-k dielectrics. The methyl or phenyl containing silylation agents were used to convert the hydrophilic -OH groups to hydrophobic groups. Compared with Trimethylchlorosilane (TMCS) and Phenyltrimethoxysilane (PTMOS), Dimethyldichlorosilane (DMDCS) was found to be more effective in recovering surface carbon concentration and surface hydrophobicity. But the carbon recovery effect was limited to the surface region. Alternatively, UV radiation with thermal activation was applied for dielectric recovery of plasma damaged OSG low-k dielectrics. The combined UV/thermal process was found to be efficient in reducing –OH, physisorbed water, and C=O bonds. The dielectric constant was recovered within 5% of the pristine sample and the leakage current was also much reduced. Aging test in air showed that no moisture retake was observed, indicating the repaired film was stable.