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Michel Koopmans

Micron Technology

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Publication

Featured researches published by Michel Koopmans.

Archive | 2001

Bumping technology in stacked die configurations

Michel Koopmans

Archive | 2011

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

Luke G. England; Paul A. Silvestri; Michel Koopmans

Archive | 2002

Component installation, removal, and replacement apparatus and method

Michel Koopmans

Archive | 2003

Method for attaching semiconductor components to a substrate using local UV curing of dicing tape

Michel Koopmans

Archive | 2008

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Michel Koopmans

Archive | 2012

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

Yangyang Sun; Michel Koopmans; Jaspreet S. Gandhi; Josh D. Woodland; Brandon P. Wirz

Archive | 2016

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOCIATED SYSTEMS AND METHODS

Jian Li; Steven K. Groothuis; Michel Koopmans

Archive | 2005

Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly

Michel Koopmans

Archive | 2014

Apparatus for testing stacked die assemblies, and related methods

Jaspreet S. Gandhi; Michel Koopmans; James M. Derderian

Archive | 2014

Semiconductor die assemblies and semiconductor devices including same

Luke G. England; Paul A. Silvestri; Michel Koopmans

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Collaboration

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Jaspreet S. Gandhi

Micron Technology

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Luke G. England

Micron Technology

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Paul A. Silvestri

Micron Technology

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James M. Derderian

Micron Technology

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Brandon P. Wirz

Micron Technology

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Jian Li

Micron Technology

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Josh D. Woodland

Micron Technology

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Steven K. Groothuis

Micron Technology

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Yangyang Sun

Micron Technology

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