Michel Koopmans

Bumping technology in stacked die configurations

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

Component installation, removal, and replacement apparatus and method

Method for attaching semiconductor components to a substrate using local UV curing of dicing tape

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOCIATED SYSTEMS AND METHODS

Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly

Apparatus for testing stacked die assemblies, and related methods

Semiconductor die assemblies and semiconductor devices including same