Ming-Sheng Yang

Air gap for tungsten/aluminum plug applications

Air gap for dual damascene applications

Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device

Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy

Method for improving non-uniformity of chemical mechanical polishing by over coating

Post-CMP wafer clean process

Method of planarization

Chemical mechanical polishing in forming semiconductor device

Chemical mechanical polishing methods using low pH slurry mixtures