Nan Marie Jokerst

Design, theory, and measurement of a polarization-insensitive absorber for terahertz imaging

We present the theory, design, and realization of a polarization-insensitive metamaterial absorber for terahertz frequencies. Effective-medium theory is used to describe the absorptive properties of the metamaterial in terms of optical constants\char22{}a description that has been thus far lacking. From our theoretical approach, we construct a device that yields over 95% absorption in simulation. Our fabricated design consists of a planar single unit-cell layer of metamaterial and reaches an absorptivity of 77% at 1.145 THz.

Infrared metamaterial phase holograms

As a result of advances in nanotechnology and the burgeoning capabilities for fabricating materials with controlled nanoscale geometries, the traditional notion of what constitutes an optical device continues to evolve. The fusion of maturing low-cost lithographic techniques with newer optical design strategies has enabled the introduction of artificially structured metamaterials in place of conventional materials for improving optical components as well as realizing new optical functionality. Here we demonstrate multilayer, lithographically patterned, subwavelength, metal elements, whose distribution forms a computer-generated phase hologram in the infrared region (10.6 μm). Metal inclusions exhibit extremely large scattering and can be implemented in metamaterials that exhibit a wide range of effective medium response, including anomalously large or negative refractive index; optical magnetism; and controlled anisotropy. This large palette of metamaterial responses can be leveraged to achieve greater control over the propagation of light, leading to more compact, efficient and versatile optical components.

Alignable epitaxial liftoff of GaAs materials with selective deposition using polyimide diaphragms

The authors report the selective and alignable deposition of patterned thin-film epitaxial GaAs/GaAlAs devices onto a host substrate such as silicon for low cost, manufacturable hybrid integrated optoelectronic circuits. The authors use a thin polyimide diaphragm as the transparent transfer medium for these patterned epitaxial devices. Each of these devices or a group of these devices on the polyimide is then optically aligned and selectively deposited onto the host substrate. The use of the polyimide transfer diaphragm also allows both the bottom and the top of the device to be processed while under substrate support. Using this technique, a light emitting diode 50*50 mu m in area and 2 mu m thick was grown on a GaAs substrate, lifted off, aligned and selectively deposited onto a silicon host substrate, and electrically contacted and tested.<<ETX>>

Integrated Optical Sensor in a Digital Microfluidic Platform

The advent of digital microfluidic lab-on-a-chip (LoC) technology offers a platform for developing diagnostic applications with the advantages of portability, increased automation, low-power consumption, compatibility with mass manufacturing, and high throughput. However, most digital microfluidic platforms incorporate limited optical capabilities (e.g., optical transmission) for integrated sensing, because more complex optical functions are difficult to integrate into the digital microfluidic platform. This follows since the sensor must be compatible with the hydrophobic surfaces on which electrowetting liquid transport occurs. With the emergence of heterogeneous photonic component integration technologies such as those described herein, the opportunity for integrating advanced photonic components has expanded considerably. Many diagnostic applications could benefit from the integration of more advanced miniaturized optical sensing technologies, such as index of refraction sensors (surface plasmon resonance sensors, microresonator sensors, etc.). The advent of these heterogeneous integration technologies, that enable the integration of thin-film semiconductor devices onto arbitrary host substrates, enables more complex optical functions, and in particular, planar optical systems, to be integrated into microfluidic systems. This paper presents an integrated optical sensor based upon the heterogeneous integration of an InGaAs-based thin-film photodetector with a digital microfluidic system. This demonstration of the heterogeneous integration and operation of an active optical thin-film device with a digital microfluidic system is the first step toward the heterogeneous integration of entire planar optical sensing systems on this platform.

Hybrid metamaterials enable fast electrical modulation of freely propagating terahertz waves

We demonstrate fast electrical modulation of freely propagating terahertz waves at room temperature using hybrid metamaterial devices. The devices are planar metamaterials fabricated on doped semiconductor epitaxial layers, which form hybrid metamaterial—Schottky diode structures. With an applied ac voltage bias, we show modulation of terahertz radiation at inferred frequencies over 2MHz. The modulation speed is limited by the device depletion capacitance which may be reduced for even faster operation.

UVB radiation generates sunburn pain and affects skin by activating epidermal TRPV4 ion channels and triggering endothelin-1 signaling

Significance Skin protects against harmful external cues, one of them UV radiation, which, upon overexposure, causes sunburn as part of the UVB response. Using genetically engineered mice and cultured skin epithelial cells, we have identified the calcium-permeable TRPV4 ion channel in skin epithelial cells as critical for translating the UVB stimulus into intracellular signals and also into signals from epithelial skin cell to sensory nerve cell that innervates the skin, causing pain. These signaling mechanisms underlie sunburn and in particular sunburn-associated pain. Thus, activation of TRPV4 in skin by UVB evokes sunburn pain, highlighting the forefront-signaling role of the skin and TRPV4. At our body surface, the epidermis absorbs UV radiation. UV overexposure leads to sunburn with tissue injury and pain. To understand how, we focus on TRPV4, a nonselective cation channel highly expressed in epithelial skin cells and known to function in sensory transduction, a property shared with other transient receptor potential channels. We show that following UVB exposure mice with induced Trpv4 deletions, specifically in keratinocytes, are less sensitive to noxious thermal and mechanical stimuli than control animals. Exploring the mechanism, we find that epidermal TRPV4 orchestrates UVB-evoked skin tissue damage and increased expression of the proalgesic/algogenic mediator endothelin-1. In culture, UVB causes a direct, TRPV4-dependent Ca2+ response in keratinocytes. In mice, topical treatment with a TRPV4-selective inhibitor decreases UVB-evoked pain behavior, epidermal tissue damage, and endothelin-1 expression. In humans, sunburn enhances epidermal expression of TRPV4 and endothelin-1, underscoring the potential of keratinocyte-derived TRPV4 as a therapeutic target for UVB-induced sunburn, in particular pain.

Dual-band planar electric metamaterial in the terahertz regime

We present the design, fabrication, and measurement of a dual-band planar metamaterial with two distinct electric resonances at 1.0 and 1.2 THz, as a step towards the development of frequency agile or broadband THz materials and devices. A method of defining the effective thickness of the metamaterial layer is introduced to simplify the material design and characterization. Good agreement between the simulated and measured transmission is obtained for the fabricated sample by treating the sample as multi-layer system, i. e. the effective metamaterial layer plus the rest of the substrate, as well as properly modeling the loss of the substrate. The methods introduced in this paper can be extended to planar metamaterial structures operating in infrared and optical frequency ranges.

Plasmon Ruler with Ångstrom Length Resolution

We demonstrate a plasmon nanoruler using a coupled film nanoparticle (film-NP) format that is well-suited for investigating the sensitivity extremes of plasmonic coupling. Because it is relatively straightforward to functionalize bulk surface plasmon supporting films, such as gold, we are able to precisely control plasmonic gap dimensions by creating ultrathin molecular spacer layers on the gold films, on top of which we immobilize plasmon resonant nanoparticles (NPs). Each immobilized NP becomes coupled to the underlying film and functions as a plasmon nanoruler, exhibiting a distance-dependent resonance red shift in its peak plasmon wavelength as it approaches the film. Due to the uniformity of response from the film-NPs to separation distance, we are able to use extinction and scattering measurements from ensembles of film-NPs to characterize the coupling effect over a series of very short separation distances-ranging from 5 to 20 Å-and combine these measurements with similar data from larger separation distances extending out to 27 nm. We find that the film-NP plasmon nanoruler is extremely sensitive at very short film-NP separation distances, yielding spectral shifts as large as 5 nm for every 1 Å change in separation distance. The film-NP coupling at extremely small spacings is so uniform and reliable that we are able to usefully probe gap dimensions where the classical Drude model of the conducting electrons in the metals is no longer descriptive; for gap sizes smaller than a few nanometers, either quantum or semiclassical models of the carrier response must be employed to predict the observed wavelength shifts. We find that, despite the limitations, large field enhancements and extreme sensitivity persist down to even the smallest gap sizes.

The heterogeneous integration of optical interconnections into integrated microsystems

Emerging techniques for integrating optoelectronic (OE) devices, analog interface circuitry, RF circuitry, and digital logic into ultra-mixed signal systems offers approaches toward and demonstrations of integrated optical interconnections in electrical microsystems. As rising data rates dictate the use of optical interconnections and interfaces at increasingly smaller distances, optical interconnections stand at a threshold of opportunity for pervasive implementation if cost-effective integration process technology and performance can be implemented. Heterogeneous integration is one approach toward the integration of compound semiconductor OE devices, Si CMOS circuits, and organic materials. Heterogeneous integration approaches, which utilize dissimilar materials which can be independently grown and optimized, and are subsequently bonded together into an integrated system, are particularly attractive methods for creating high-performance microsystems. This paper describes a variety of optical interconnections integrated into microsystems using thin film heterogeneous integration. Thin film heterogeneous integration is attractive from the standpoint that the topography of the integrated microsystem can remain flat to within a few microns, substrates which are often optically absorbing are removed, both sides of the thin film devices can be processed (e.g., contacted, optically coated), and three-dimensionally stacked structures can be implemented. Demonstrations of interconnections using thin film heterogeneous integration technology include an integrated InGaAs/Si CMOS receiver circuit operating at 1 Gbps, an InGaAs thin film photodetector bonded onto a foundry Si CMOS microprocessor to demonstrate a single chip optically interconnected microprocessor, smart pixel emitter and detector arrays using resonant cavity enhanced P-i-N photodetectors bonded on top of per-pixel current controlled oscillators and resonant cavity enhanced light emitting diodes integrated onto digital to analog converter gray-scale per-pixel driver circuitry, and photodetectors embedded in waveguides on electrical interconnection substrates to demonstrate chip-to-chip embedded waveguide interconnections.

A Polymer Microdisk Photonic Sensor Integrated Onto Silicon

Optical sensors are attractive for integrated chip-scale sensor systems. In this letter, integrated microdisk sensors have been fabricated and characterized for five different D-glucose concentrations in deionized water. The microdisk sensor reported is in an orthogonal configuration, reducing the sensor size toward chip-scale sensor applications. The measured wavelength shift in the resonant peak of the microdisk sensors has a linear response as a function of D-glucose concentration. The estimated sensitivity (defined by Deltalambdaresonant/wt%D-glucose) of the fabricated microdisk sensor for the D-glucose solution was 0.12[nm/wt%] based on the slope of the linear regression line from the measured results