P. Monfraix

Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging

This paper presents the electrical design, measurement and reliability tests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [¿55°C, +125°C] temperature range.

Is hermitic encapsulation of GaAs MMIC still required for space applications

This paper presents the introduction of the nonhermetic encapsulation of microwave hybrids for space application. Thanks to the improvement for many years now of organic materials, it is now realistic to propose a glob top encapsulation of GaAs MMIC on printed circuit boards. To validate this packaging approach, a reliability test-plan is proposed based on humidity tests, life tests and thermal cyclings in agreement with standard space quality requirements. Six modules per test-file have been manufactured. No failures are reported by visual inspection and on electrical characteristics at the end of the three test-files.

New 3D low loss, wide band microwave interconnection

This paper describes a new wide band [0; 40 GHz] vertical interconnection approach between two RF homogeneously grounded coplanar lines. It can be considered as two 90/spl deg/ vertical bends transition. Both electromagnetic simulation and measurement demonstrate very good results on the whole frequency range.

Non hermetic microwave packaging : a reality for space application

This paper presents the introduction of the non hermetic encapsulation of microwave hybrids for space application through the development of a new generation of low noise amplifier modules for a feed array fed reflector antenna for multimedia applications in Ka-band. Thanks to the improvement for many years now of organic materials, it is now realistic to propose advanced packaging solutions based on the chip on board approach with glob top encapsulation of active devices on printed circuit boards. To validate this packaging approach, reliability test-plans were proposed for each process/material (board substrate, assembly of components, module connection and glob top encapsulation) in agreement with standard space quality requirements. No failure is reported after visual inspection and on electrical characteristics at the end of the reliability test-files

3D Beam Forming Network for High Integration Active Antennas

This paper describes current developments in Alcatel Space Industries carried out on a new concept of beam forming network, realized by molding assembly and using new 3D RF packaging technologies and interconnections. The aim is to be able to address a large panel of applications without any concept or technology major changes.

3D Active Modules for High Integration Active Antennas

This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly.

A Ka/IF down-converter for space application with embedded microwave passives and DC networks

This paper presents the electrical design and measurements of a Ka/IF down-converter module for multimedia space application. Using the partitioning approach and MCM-D technology, a collective process, both microwave and DC passives were embedded on the substrate. A size reduction by a factor 2 of the module is finally obtained in comparison with current qualified technologies with no degradation of the electrical characteristics.

Microwave glob top for space applications : A route to non hermiticity

This paper presents the electrical design, measurement and reliability tests of an encapsulated MMIC using a dam & fill technique. Materials, dispensing techniques, RF design are evaluated. Test samples have been designed and manufactured. Electrical results show a slight decay in frequency of the electrical characteristics (about 300MHz) but the component still offers good performances in the relevant bandwidth for receivers.

A new concept of RF feed-through applied to multichip modules for space equipment

This paper presents the electrical design and measurement of a new microwave transition for MMIC packages, fully integrated in the fabrication process of multichip modules. Electrical simulations show very good results up to 27 GHz. Test samples have been realised with standard design rules from the MCM-C manufacturer on aluminium nitride substrate and electrical measurements up to 20 GHz show the same insertion losses as current RF feed-throughs.

Tailoring Polymer-Ceramic Composites for Microelectronic Applications: The role of the polymer matrix on the dielectric behaviour

It was the aim of this work to characterize the dielectric behaviour of only-polymer samples understanding the matrix behaviour prior to tailor a final low dielectric constant, low dielectric loss polymer-ceramic composite material. The dielectric study was performed by analyzing the temperature and frequency dependence of polymer sample discs before testing composite samples for comparison. It will be concluded the important role of the polymer matrix mainly on composite temperature dependence.