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Dive into the research topics where Patrick H. Buffet is active.

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Featured researches published by Patrick H. Buffet.


custom integrated circuits conference | 2000

Methodology for I/O cell placement and checking in ASIC designs using area-array power grid

Patrick H. Buffet; Joseph Natonio; Robert A. Proctor; Yu.H. Sun; G. Yasar

Electrical rule checking is fundamental to achieve a good I/O cell placement. This paper presents the analysis techniques used to design a robust power-grid structure, the method used to make I/O cell placement guidelines, details of the I/O cell placement process and electrical checking algorithms.


Ibm Journal of Research and Development | 2002

Issues and strategies for the physical design of system-on-a-chip ASICs

Thomas R. Bednar; Patrick H. Buffet; Randall J. Darden; Scott Whitney Gould; Paul S. Zuchowski

The density and performance of advanced silicon technologies have made system-on-a-chip ASICs possible. SoCs bring together a diverse set of functions and technology features on a single die of enormous complexity. The physical design of these complex ASICs requires a rich set of functional elements that integrate efficiently with a set of design flows and tools productive enough to meet product requirements successfully, without consuming more time or design resources than a simpler design. The architecture described, including functional libraries and physical design conventions, enables the creation of multiple SoC ASIC designs from a common infrastructure that addresses silicon integration, electrical robustness, and packaging challenges. An implementation strategy follows from this design infrastructure that includes hierarchical design concepts, placement, routing, and verification processes.


custom integrated circuits conference | 1999

The first copper ASICs: A 12M-gate technology

Jeannie H. Panner; Thomas R. Bednar; Patrick H. Buffet; Douglas W. Kemerer; Douglas W. Stout; Paul S. Zuchowski

This paper describes the first CMOS ASIC logic family built with copper metallurgy. Chips with up to 12-million equivalent gates can be designed in the 0.16 /spl mu/m process. The technology, product characteristics, CAD system and first customer chips are discussed.


Archive | 2000

Method of assigning integrated circuit I/O signals in an integrated circuit package

Patrick H. Buffet; Paul E. Dunn; Joseph Natonio; Robert A. Proctor; Gulsun Yasar


Archive | 2002

Method of analyzing integrated circuit power distribution in chips containing voltage islands

Patrick H. Buffet; Joseph N. Kozhaya; Paul D. Montane; Robert A. Proctor; Erich C. Schanzenbach; Ivan L. Wemple


Archive | 2001

Method of designing a voltage partitioned wirebond package

Patrick H. Buffet; Charles S. Chiu; Yu H. Sun


Archive | 2001

Method of designing a voltage partitioned solder-bump package

Patrick H. Buffet; Charles S. Chiu; Yu H. Sun


Archive | 2003

Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid

Thomas R. Bednar; Timothy W. Budell; Patrick H. Buffet; Alain Caron; James V. Crain; Douglas W. Kemerer; Donald S. Kent; Esmaeil Rahmati


Archive | 2001

Integrated circuit bus grid having wires with pre-selected variable widths

Patrick H. Buffet; Yu H. Sun


Archive | 2000

Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages

Patrick H. Buffet; Craig P. Lussier; Joseph Natonio

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