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Paul H. Wermer

Intel

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Publication

Featured researches published by Paul H. Wermer.

Archive | 2001

Microelectronic package having a bumpless laminated interconnection layer

Steven Towle; Paul H. Wermer

Archive | 2000

Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance

Paul H. Wermer; Brian A. Kaiser

Archive | 2000

Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture

Kishore K. Chakravorty; Paul H. Wermer; David G. Figueroa; Debabrata Gupta

Archive | 2000

Solderless electronics packaging

Ajit V. Sathe; Paul H. Wermer

Archive | 2003

Method of fabricating microelectronic package having a bumpless laminated interconnection layer

Steven Towle; Paul H. Wermer

Archive | 2004

Solderless electronics packaging and methods of manufacture

Ajit V. Sathe; Paul H. Wermer

Archive | 2002

Polymeric dielectric material for high-energy density capacitors

Paul A. Koning; Paul H. Wermer

Archive | 2004

Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors

Kishore K. Chakravorty; Paul H. Wermer; David G. Figueroa; Debabrata Gupta

Archive | 2006

Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors

Kishore K. Chakravorty; Paul H. Wermer; David G. Figueroa; Debabrata Gupta

Archive | 2004

Circuit board with organic dielectric layer

Paul H. Wermer; Brian A. Kaiser

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David G. Figueroa

Intel

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Debabrata Gupta

Intel

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Kishore K. Chakravorty

Intel

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Steven Towle

Intel

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Ajit V. Sathe

Intel

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Brian A. Kaiser

Intel

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Paul A. Koning

Intel

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