Piet Engelke

X-masking during logic BIST and its impact on defect coverage

We present a technique for making a circuit ready for logic built-in self test by masking unknown values at its outputs. In order to keep the silicon area cost low, some known bits in output responses are also allowed to be masked. These bits are selected based on a stuck-at n-detection based metric, such that the impact of masking on the defect coverage is minimal. An analysis based on a probabilistic model for resistive short defects indicates that the coverage loss for unmodeled defects is negligible for relatively low values of n.

Simulating resistive bridging and stuck-at faults

We present a simulator for resistive bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look-up, thus exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; reciprocal action of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed and quantitative results with respect to all these definitions are given for the first time.The authors present a simulator for resistive-bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look up, thus, exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; interaction of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive-bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed, and quantitative results with respect to all these definitions are given for the first time

Simulating Resistive-Bridging and Stuck-At Faults

The authors present a simulator for resistive-bridging and stuck-at faults. In contrast to earlier work, it is based on electrical equations rather than table look up, thus, exposing more flexibility. For the first time, simulation of sequential circuits is dealt with; interaction of fault effects in current time frame and earlier time frames is elaborated on for different bridge resistances. Experimental results are given for resistive-bridging and stuck-at faults in combinational and sequential circuits. Different definitions of fault coverage are listed, and quantitative results with respect to all these definitions are given for the first time

Thread-Parallel Integrated Test Pattern Generator Utilizing Satisfiability Analysis

Efficient utilization of the inherent parallelism of multi-core architectures is a grand challenge in the field of electronic design automation (EDA). One EDA algorithm associated with a high computational cost is automatic test pattern generation (ATPG). We present the ATPG tool TIGUAN based on a thread-parallel SAT solver. Due to a tight integration of the SAT engine into the ATPG algorithm and a carefully chosen mix of various optimization techniques, multi-million-gate industrial circuits are handled without aborts. TIGUAN supports both conventional single-stuck-at faults and sophisticated conditional multiple stuck-at faults which allows to generate patterns for non-standard fault models. We demonstrate how TIGUAN can be combined with conventional structural ATPG to extract full benefit of the intrinsic strengths of both approaches.

A Simulator of Small-Delay Faults Caused by Resistive-Open Defects

We present a simulator which determines the coverage of small-delay faults, i.e., delay faults with a size below one clock cycle, caused by resistive-open defects. These defects are likely to escape detection by stuck-at or transition fault patterns. For the first time, we couple the calculation of the critical size of a small-delay fault with the computation of the resistance range of the corresponding resistive-open defect for which this size is exceeded. By doing so, we are able to extend probabilistic fault coverage metrics initially developed for static resistive bridging faults to small-delay defects.

Automatic Test Pattern Generation for Interconnect Open Defects

We present a fully automated flow to generate test patterns for interconnect open defects. Both inter-layer opens (open- via defects) and arbitrary intra-layer opens can be targeted. An aggressor-victim model used in industry is employed to describe the electrical behavior of the open defect. The flow is implemented using standard commercial tools for parameter extraction (PEX) and test generation (ATPG). A highly optimized branch-and bound algorithm to determine the values to be assigned to the aggressor lines is used to reduce both the ATPG efforts and the number of aborts. The resulting test sets are smaller and achieve a higher defect coverage than stuck-at n-detection test sets, and are robust against process variations.

Resistive Bridge fault model evolution from conventional to ultra deep submicron

We present three resistive bridging fault models valid for different CMOS technologies. The models are partitioned into a general framework (which is shared by all three models) and a technology-specific part. The first model is based on Shockley equations and is valid for conventional but not deep submicron CMOS. The second model is obtained by fitting SPICE data. The third resistive bridging fault model uses Berkeley predictive technology model and BSIM4; it is valid for CMOS technologies with feature sizes of 90nm and below, accurately describing non-trivial electrical behavior in that technologies. Experimental results for ISCAS circuits show that the test patterns obtained for the Shockley model are still valid for the fitted model, but lead to coverage loss under the predictive model.

The pros and cons of very-low-voltage testing: an analysis based on resistive bridging faults

Test application at reduced power supply voltage (or VLV testing) is a cost-effective way to increase the defect coverage of a test set. Resistive short defects are a major contributor to this coverage increase. Using a probabilistic model of these defects, we quantify the coverage impact of VLV testing for different voltages. When considering the coverage increase, we differentiate between defects missed by the test set at nominal voltage and undetectable defects (flaws) detected by VLV testing. In our analysis, the performance degradation of the device caused by lower power supply voltage is accounted for. Furthermore, we describe a situation in which defects detected by conventional testing are missed by VLV testing and quantify the resulting coverage loss. We report the numbers on the increased defect coverage, flaw coverage, and coverage loss for ISCAS circuits.

Extraction, Simulation and Test Generation for Interconnect Open Defects Based on Enhanced Aggressor-Victim Model

We present a flow to extract, simulate and generate test patterns for interconnect open defects. In contrast to previous work, the accuracy of defect modeling is improved by taking the thresholds of logic gates as well as noise margins into account. Efficient fault simulation is enabled by employing an aggressive fault collapsing strategy and an optimized fault list ordering heuristic which allows to combine the advantages of event-driven simulation with bit parallelism. Test generation complexity is kept in check by generating patterns for technology-independent segment-stuck-at faults first, thus reducing (though not completely eliminating) the need for sophisticated technology-aware test generation. Moreover, a comprehensive untestability analysis identifies new classes of untestable faults. Experimental results demonstrate high efficiency of the new flow, outperforming earlier work by two orders of magnitude.

TIGUAN: Thread-Parallel Integrated Test Pattern Generator Utilizing Satisfiability ANalysis

We present the automatic test pattern generator TIGUAN based on a thread-parallel SAT solver. Due to a tight integration of the SAT engine into the ATPG algorithm and a carefully chosen mix of various optimization techniques, multi-million-gate industrial circuits are handled without aborts. TIGUAN supports both conventional single-stuck-at faults and sophisticated conditional multiple stuck-at faults which allows to generate patterns for non-standard fault models.