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Werner Robl

IBM

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Publication

Featured researches published by Werner Robl.

Archive | 2001

Liner with poor step coverage to improve contact resistance in W contacts

Roy C. Iggulden; Padraic Shafer; Werner Robl; Kwong Hon Wong

Archive | 2003

Nitride and polysilicon interface with titanium layer

Ronald Joseph Schutz; Werner Robl; Rajeev Malik; Lawrence A. Clevenger; Oleg Gluschenkov; Cyril Cabral; Roy C. Iggulden; Yun-Yu Wang; Keith Kwong Hon Wong; Irene McStay

Archive | 2002

Low Cu percentages for reducing shorts in AlCu lines

Roy C. Iggulden; Padraic Shafer; Kwong Hon Wong; Michael M. Iwatake; Jay W. Strane; Thomas Goebel; Donna D. Miura; Chet Dziobkowski; Werner Robl; Brian Hughes

Archive | 2002

Filling a damascene structure involves coating damascene structure by liner providing poor step coverage, depositing tungsten by chemical vapor deposition, and performing metal isolation process

Roy C. Iggulden; Werner Robl; Padraic Shafer; Kwong Hon Wong

Archive | 2004

Method and apparatus for improving the electrical resistance of conductive paths

Werner Robl; Roy C. Iggulden; Padraic Shafer; Keith Kwong Hon Wong

Archive | 2005

Nitrid- und Polysiliziumgrenzschicht mit Titanschicht

Cyril Cabral; Roy C. Iggulden; Irene McStay; Lawrence A. Clevenger; Yun Yu Wang; Keith Kwong Hon Wong; Werner Robl; Oleg Gluschenkov; Rajeev Malik; Ronald J. Schutz

Archive | 2004

Geringer Kupferanteil zum Verringern von Kurzschlüssen in AICu-Leitungen

Chester T. Dziobkowski; Thomas Goebel; Brian Hughes; Roy C. Iggulden; Michael M. Iwatake; Donna D. Miura; Werner Robl; Padraic Shafer; Kwong Hon Wong; Jay W. Strane

Archive | 2004

Verfahren und Anordnung zum Verbessern des elektrischen Widerstands von Leiterbahnen

Padraic Shafer; Roy C. Iggulden; Kwong Hon Wong; Werner Robl

Archive | 2004

Verfahren und Anordnung zum Verbessern des elektrischen Widerstands von Leiterbahnen Method and apparatus for improving the electrical resistance of interconnects

Roy C. Iggulden; Werner Robl; Padraic Shafer; Kwong Hon Wong

Archive | 2003

Nitrid- und Polysiliziumgrenzschicht mit Titanschicht Nitride and polysilicon boundary layer with titanium layer

Cyril Cabral; Lawrence A. Clevenger; Oleg Gluschenkov; Roy C. Iggulden; Rajeev Malik; Irene McStay; Werner Robl; Ronald J. Schutz; Yun Yu Wang; Keith Kwong Hon Wong

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Collaboration

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Roy C. Iggulden

IBM

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Padraic Shafer

IBM

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Kwong Hon Wong

IBM

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Rajeev Malik

IBM

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Thomas Goebel

IBM

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Keith Kwong Hon Wong

IBM

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Cyril Cabral

IBM

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Irene McStay

IBM

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Lawrence A. Clevenger

IBM

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Oleg Gluschenkov

IBM

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