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Reynaldo Corpuz Javier

Texas Instruments

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Publication

Featured researches published by Reynaldo Corpuz Javier.

Archive | 2011

Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe

Reynaldo Corpuz Javier; Sreenivasan K. Koduri

Archive | 2015

Structure and method of packaged semiconductor devices with bent-lead qfn leadframes

Andy Quang Tran; Reynaldo Corpuz Javier; Alok Kumar Lohia

Archive | 2007

Packaged integrated circuits and methods to form a stacked integrated circuit package

Reynaldo Corpuz Javier; Jayprakash V. Chipalkatti; Alok Kumar Lohia

Archive | 2016

FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES

Reynaldo Corpuz Javier; Alok Kumar Lohia; Andy Quang Tran

Archive | 2014

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPOSED BY GROOVES IN PACKAGE COMPOUND

Alok Kumar Lohia; Reynaldo Corpuz Javier; Andy Quang Tran

Archive | 2006

Integrated Circuits Having Controlled Inductances

Anthony L. Coyle; Reynaldo Corpuz Javier; Jeffrey Gail Holloway

Archive | 2016

PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHANGING THE ASSEMBLY PAD

Alok Kumar Lohia; Reynaldo Corpuz Javier; Andy Quang Tran

Archive | 2015

Exposed pad integrated circuit package

Reynaldo Corpuz Javier; Alok Kumar Lohia; Andy Quang Tran

Archive | 2015

Structure and method of packaged semiconductor devices

Andy Quang Tran; Reynaldo Corpuz Javier; Alok Kumar Lohia

Archive | 2015

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

Andy Quang Tran; Alok Kumar Lohia; Reynaldo Corpuz Javier

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Alok Kumar Lohia

Texas Instruments

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Andy Quang Tran

Texas Instruments

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Sreenivasan K. Koduri

Texas Instruments

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Anthony L. Coyle

Texas Instruments

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Jeffrey Gail Holloway

Texas Instruments

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