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Robert T. Trabucco

LSI Corporation

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Publication

Featured researches published by Robert T. Trabucco.

Archive | 1994

Integrated circuit having a coplanar solder ball contact array

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1995

Semiconductor device package fabrication method and apparatus

Mark R. Schneider; Robert T. Trabucco

Archive | 1993

Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package

Robert T. Trabucco

Archive | 1995

Casting of raised bump contacts on a substrate

Robert T. Trabucco

Archive | 1994

Fixture for attaching multiple lids to multi-chip module (MCM) integrated circuit

Sutee Vongfuangfoo; Robert T. Trabucco

Archive | 1995

Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1999

Fluxless solder ball attachment process

Robert T. Trabucco

Archive | 1997

Method for compensating for bottom warpage of a BGA integrated circuit

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1998

Conductive polymer ball attachment for grid array semiconductor packages

Robert T. Trabucco

Archive | 1997

Method for planarizing an array of solder balls

Patrick Variot; Chok J. Chia; Robert T. Trabucco

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Chok J. Chia

LSI Corporation

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Patrick Variot

LSI Corporation

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Mark R. Schneider

LSI Corporation

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Sutee Vongfuangfoo

LSI Corporation

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