Robert W. Wu

MxP+: A new dielectric etcher with enabling technology, high productivity, and low cost‐of‐consumables

Dielectric etch accounts for more than half of all the dry etches used in integrated circuit (IC) fabrication, and plays a very important role in fulfilling strict requirements of volume‐manufacturing of IC circuits whose feature size is progressively decreasing. The challenge of meeting volume manufacture requirements is what MxP+ has achieved through a series of hardware and process innovations. By Pareto analysis of the wet clean time of the MxP chamber, we were able to define six major drivers to address three key issues: (1) reduce wet clean time, (2) eliminate system complexity, and (3) achieve technical excellence. Key components of the MxP+ that allow us to address them include a quartz gas distribution plate which prevents the aluminum particle formation, and the electrostatic chuck which eliminates the mechanical clamp system while reducing the particle contamination and wafer edge exclusion. The unique chamber liners of the MxP+ not only shield chamber walls, but also provided a wide process wi...

Pilot studies of the manufacturing worthiness of mixed chemistry processings in a MERIE plasma tool

This paper presents ground level feasibility study of mix-run capability on applications of metal via etches in a simulated production environment. A mini-marathon was set up to understand any particulate problems and process shift during mix-run in a MERIE plasma etch tool-a commercially available Super e chamber. Particulate, oxide and PR etch rate data will be shown to demonstrate that Super e is a production worthy etch tool for mix-run with different chemistries on metal via etch applications.