Ananda H. Kumar | Researchain

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Featured researches published by Ananda H. Kumar.

Archive | 1997

High density plasma process chamber

Shamouil Shamouilian; Ananda H. Kumar; Arnold Kholodenko; Dennis S. Grimard; Jonathan D. Mohn; Michael G. Chafin; Kenneth S. Collins

Archive | 1997

Electrostatic chuck having improved gas conduits

Edwin C. Weldon; Kenneth S. Collins; Arik Donde; Brian Lue; Dan Maydan; Robert J. Steger; Timothy Dyer; Ananda H. Kumar; Alexander M. Veytser; Kadthala R. Narendrnath; Semyon L. Kats; Arnold Kholodenko; Shamouil Shamouilian; Dennis S. Grimard

Archive | 1999

Electrostatic chuck having gas cavity and method

Arnold Kholodenko; Shamouil Shamouilian; You Wang; Wing L. Cheng; Alexander M. Veytser; Surinder S. Bedi; Kadthala R. Narendrnath; Semyon L. Kats; Dennis S. Grimard; Ananda H. Kumar

Archive | 1998

Electrostatic chuck capable of rapidly dechucking a substrate

Ananda H. Kumar; Shamouil Shamouilian

Archive | 1998

Compliant bond structure for joining ceramic to metal

Ananda H. Kumar; Kadthala R. Narendrnath; Shamouil Shamouilian

Archive | 2001

Gas distribution plate electrode for a plasma reactor

Dan Katz; Douglas A. Buchberger; Yan Ye; Robert B. Hagen; Xiaoye Zhao; Ananda H. Kumar; Kang-Lie Chiang; Hamid Noorbakhsh; Shiang-Bau Wang

Archive | 2002

Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers

Jennifer Y. Sun; Shun Jackson Wu; Senh Thach; Ananda H. Kumar; Robert W. Wu; Hong Wang; Yixing Lin; Clifford C. Stow

Archive | 2001

Electrostatic chuck bonded to base with a bond layer and method

You Wang; Shamouil Shamouilian; Arnold Kholodenko; Alexander M. Veytser; Surinder S. Bedi; Kadthala R. Narendrnath; Semyon L. Kats; Dennis S. Grimard; Wing L. Cheng; Ananda H. Kumar

Archive | 2002

Electrostatic chuck having composite dielectric layer and method of manufacture

Archive | 2008

Method of coating semiconductor processing apparatus with protective yttrium-containing coatings

Jennifer Y. Sun; Shun Jackson Wu; Senh Thach; Ananda H. Kumar; Robert W. Wu; Hong Wang; Yixing Lin; Clifford C. Stow; Jim Dempster; Li Xu; Kenneth S. Collins; Ren-Guan Duan; Thomas Graves; Xiaoming He; Jie Yuan

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