Ronald D. Briggs

Comparison of fabrication approaches for selectively oxidized VCSEL arrays

The impressive performance improvements of laterally oxidized VCSELs come at the expense of increased fabrication complexity for 2-dimensional arrays. Since the epitaxial layers to be wet-thermally oxidized must be exposed, non-planarity can be an issue. This is particularly important in that electrical contact to both the anode and cathode of the diode must be brought out to a package. We have investigated four fabrication sequences suitable for the fabrication of 2- dimensional VCSEL arrays. These techniques include: mesa etched polymer planarized, mesa etched bridge contacted, mesa etched oxide isolated (where the electrical trace is isolated from the substrate during the oxidation) and oxide/implant isolation (oxidation through small via holes) all of which result in VCSELs with outstanding performance. The suitability of these processes for manufacturing are assessed relative to oxidation uniformity, device capacitance, and structural ruggedness for packaging.

Single transverse mode selectively oxidized vertical cavity lasers

Vertical cavity surface emitting lasers (VCSELs) which operate in multiple transverse optical modes have been rapidly adopted into present data communication applications which rely on multi-mode optical fiber. However, operation only in the fundamental mode is required for free space interconnects and numerous other emerging VCSEL applications. Two device design strategies for obtaining single mode lasing in VCSELs based on mode selective loss or mode selective gain are reviewed and compared. Mode discrimination is attained with the use of a thick tapered oxide aperture positioned at a longitudinal field null. Mode selective gain is achieved by defining a gain aperture within the VCSEL active region to preferentially support the fundamental mode. VCSELs which exhibit greater than 3 mW of single mode output power at 850 nm with mode suppression ratio greater than 30 dB are reported.

Electronic properties of the AlGaN/GaN heterostructure and two-dimensional electron gas observed by electroreflectance

A contacted electroreflectance technique was used to investigate AlGaN/GaN heterostructures and their intrinsic electric field-induced properties. By studying variations in the electroreflectance with applied field, spectral features associated with the AlGaN barrier, the two-dimensional electron gas at the interface, and bulk GaN were identified. Barrier-layer composition and electric field were determined from the AlGaN Franz–Keldysh oscillations. For a high mobility heterostructure grown on SiC, measured AlGaN polarization electric field and two-dimensional electron gas density approached values predicted by a standard bandstructure model. The two-dimensional electron gas produced a broad, field-tunable first derivative electroreflectance feature. With a dielectric function calculation, we describe the line shape and relative amplitude of the two-dimensional electron gas electroreflectance feature for a wide range of electron density and applied field values.A contacted electroreflectance technique was used to investigate AlGaN/GaN heterostructures and their intrinsic electric field-induced properties. By studying variations in the electroreflectance with applied field, spectral features associated with the AlGaN barrier, the two-dimensional electron gas at the interface, and bulk GaN were identified. Barrier-layer composition and electric field were determined from the AlGaN Franz–Keldysh oscillations. For a high mobility heterostructure grown on SiC, measured AlGaN polarization electric field and two-dimensional electron gas density approached values predicted by a standard bandstructure model. The two-dimensional electron gas produced a broad, field-tunable first derivative electroreflectance feature. With a dielectric function calculation, we describe the line shape and relative amplitude of the two-dimensional electron gas electroreflectance feature for a wide range of electron density and applied field values.

Thermal Design and Characterization of Heterogeneously Integrated InGaP/GaAs HBTs

Flip-chip heterogeneously integrated n-p-n InGaP/GaAs heterojunction bipolar transistors (HBTs) with integrated thermal management on wide-bandgap AlN substrates followed by GaAs substrate removal are demonstrated. Without thermal management, substrate removal after integration significantly aggravates self-heating effects, causing poor I - V characteristics due to excessive device self-heating. An electrothermal codesign scheme is demonstrated that involves simulation (design), thermal characterization, fabrication, and evaluation. Thermoreflectance thermal imaging, electrical-temperature sensitive parameter-based thermometry, and infrared thermography were utilized to assess the junction temperature rise in HBTs under diverse configurations. In order to reduce the thermal resistance of integrated devices, passive cooling schemes assisted by structural modification, i.e., positioning indium bump heat sinks between the devices and the carrier, were employed. By implementing thermal heat sinks in close proximity to the active region of flip-chip integrated HBTs, the junction-to-baseplate thermal resistance was reduced over a factor of two, as revealed by junction temperature measurements and improvement of electrical performance. The suggested heterogeneous integration method accounts for not only electrical but also thermal requirements providing insight into realization of advanced and robust III-V/Si heterogeneously integrated electronics.

Active guided-mode resonant subwavelength gratings.

We design and fabricate guided-mode resonant subwavelength gratings using an active layer of barium titanate. Loss mechanisms in the metal and in the guiding layer are investigated. Modeling and experimental results are shown.

Fabrication, packaging, and performance of VCSELs and photodetectors for space applications

Optocouplers are used for a variety of applications aboard spacecraft including electrical isolation, switching and power transfer. Commercially available light emitting diode- based optocouplers have experienced severe degradation of light output due to extensive displacement during damage occurring in the semiconductor lattice caused by energetic proton bombardment. A new optocoupler has been designed and fabricated which utilizes vertical cavity surface emitting laser (VCSEL) and resonant cavity photodetector (RCPD) technologies for the optocoupler emitter and detector, respectively. Linear arrays of selectively oxidized GaAs/AlGaAs VCSELs and RCPDs, each designed to operate at a wavelength of 850 nm, were fabricated using an airbridge contacting scheme. The airbridged contacts were designed to improve packaging yields and device reliability by eliminating the use of a polyimide planarizing layer which provided poor adhesion to the bond pad metallization. Details of the airbridged optocoupler fabrication process are reported. Discrete VCSEL and RCPD devices were characterized at temperatures between -100 degree(s)C to 100 degree(s)C. Devices were packaged in a face-to-face configuration to form a single channel optocoupler and its performance was evaluated under conditions of high-energy proton bombardment.

Adhesion studies of GaAs-based ohmic contact and bond pad metallization

Adhesion strength and surface morphology of commonly used n- and p-type ohmic contacts and pad metallization schemes for GaAs were investigated. GeNiAu, GePdAu, BeAu, and TiPtAu (being studied as potential ohmic contacts for internal optoelectronic devices) had quantitiative measurements made using wire bond pull testing to determine adhesion. Bond pad metals deposited as evaporated TiAu, TiPtAu, and 2-5 micron thick electroplated Au deposited on both semi-insulating GaAs and on Si{sub 3}N{sub 4}/GaAs were evaluated independently from the ohmic contact metals. In all samples was observed a strong correlation between surface treatment, surface morphology, wire bondability, and bond strength. Very high bond strengths (pull test average values above 6.5 grams force with 25 micron dia Au wire) wereobtained for n-type, p-type, and bond pad metals. Average values of 8.0 gram force were achieved with two-step GeAu/NiAu/TiPtAu metallization, while one-step deposition yielded poorer values. Adhesion was also monitored after aging at 250 C in air for four different times up to 60 hr by wire bond pull testing, with little degradation occurring.

Materials physics and device development for improved efficiency of GaN HEMT high power amplifiers.

GaN-based microwave power amplifiers have been identified as critical components in Sandias next generation micro-Synthetic-Aperture-Radar (SAR) operating at X-band and Ku-band (10-18 GHz). To miniaturize SAR, GaN-based amplifiers are necessary to replace bulky traveling wave tubes. Specifically, for micro-SAR development, highly reliable GaN high electron mobility transistors (HEMTs), which have delivered a factor of 10 times improvement in power performance compared to GaAs, need to be developed. Despite the great promise of GaN HEMTs, problems associated with nitride materials growth currently limit gain, linearity, power-added-efficiency, reproducibility, and reliability. These material quality issues are primarily due to heteroepitaxial growth of GaN on lattice mismatched substrates. Because SiC provides the best lattice match and thermal conductivity, SiC is currently the substrate of choice for GaN-based microwave amplifiers. Obviously for GaN-based HEMTs to fully realize their tremendous promise, several challenges related to GaN heteroepitaxy on SiC must be solved. For this LDRD, we conducted a concerted effort to resolve materials issues through in-depth research on GaN/AlGaN growth on SiC. Repeatable growth processes were developed which enabled basic studies of these device layers as well as full fabrication of microwave amplifiers. Detailed studies of the GaN and AlGaN growth of SiC were conducted and techniques to measure the structural and electrical properties of the layers were developed. Problems that limit device performance were investigated, including electron traps, dislocations, the quality of semi-insulating GaN, the GaN/AlGaN interface roughness, and surface pinning of the AlGaN gate. Surface charge was reduced by developing silicon nitride passivation. Constant feedback between material properties, physical understanding, and device performance enabled rapid progress which eventually led to the successful fabrication of state of the art HEMT transistors and amplifiers.

Final Report on LDRD Project: Heterogeneous Integration of Optoelectronic Arrays and Microelectronics

Integrated microsystems provide the benefits of small size, low power consumption, robustness, and potentially inexpensive manufacture. However, multifunctional advanced microsystems often require a combination of microelectronic and photonic technologies, For example, high-density 2-dimensional integrated optoelectronic arrays are the basic components necessary to construct real-time electro-optical signal processing and analog information processing microsystems. In corresponding *no longer at Sandia **L&M Technologies, Inc.

High Al-Content AlInGaN Devices for Next Generation Electronic and Optoelectronic Applications

Great strides have been made in the development of ultraviolet LED materials and devices. Power levels in the near UV (below 390 nm) have been improved from the 10 W to the 1 mW level through improvements in the growth and design of AlInGaN alloys. High frequency AlGaN/GaN HEMTs have been developed with ft of 65 GHz and fmax of 85 GHz, all while attaining breakdown voltage greater than 100 V. A new breakthrough in the lateral overgrowth of GaN materials promises to further improve these devices.