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Sang-hyeop Lee

Samsung

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Publication

Featured researches published by Sang-hyeop Lee.

Archive | 1998

Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed thereby

Seung-Hwan Lee; Sang-hyeop Lee; Young-sun Kim; Se-jin Shim; You-chan Jin; Ju-Tae Moon; Jin-seok Choi; Young-Min Kim; Kyunghoon Kim; Kab-jin Nam; Young-wook Park; Seok-jun Won; Young-dae Kim

Archive | 2000

Methods of forming integrated circuit capacitors having doped HSG electrodes and capacitors formed thereby

Seung-Hwan Lee; Sang-hyeop Lee; Young-sun Kim; Se-jin Shim; You-chan Jin; Ju-Tae Moon; Jin-seok Choi; Young Min Kim; Kyunghoon Kim; Kab-jin Nam; Young-wook Park; Seok-jun Won; Young Dae Kim

Archive | 2003

Integrated circuit capacitors having doped HSG electrodes

Seung-Hwan Lee; Sang-hyeop Lee; Young-sun Kim; Se-jin Shim; You-chan Jin; Ju-Tae Moon; Jin-seok Choi; Young Min Kim; Kyunghoon Kim; Kab-jin Nam; Young-wook Park; Seok-jun Won; Young Dae Kim

Archive | 1998

Plasma enhanced chemical vapor deposition methods of forming hemispherical grained silicon layers

Young-sun Kim; Sang-hyeop Lee; Seung-Hwan Lee; Young-wook Park; Mikio Takagi

Archive | 2003

Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method

Sang-hyeop Lee; Hee-Kook Choi

Archive | 2007

METHOD OF FORMING A MASK PATTERN FOR FABRICATING A SEMICONDUCTOR DEVICE

Hyongsoo Kim; Sang-hyeop Lee

Archive | 2000

Methods of forming integrated circuit capacitors having doped HSG electrodes

Seung-Hwan Lee; Sang-hyeop Lee; Young-sun Kim; Se-jin Shim; You-chan Jin; Ju-Tae Moon; Jin-seok Choi; Young-Min Kim; Kyunghoon Kim; Kab-jin Nam; Young-wook Park; Seok-jun Won; Young-dae Kim

Archive | 2005

Lead on chip semiconductor package

Sang-hyeop Lee; Se-Yong Oh; Jing-Ho Kim; Chan-Suk Lee; Min-Keun Kwak; Sung-Hwan Yoon; Tae-Duk Nam

Archive | 2006

Halbleiterchippackungsvorrichtung und zugehöriges Endbehandlungsverfahren

Hee-Kook Choi; Ki-Kwon Jeong; Se-young Jeong; Nam-Seog Yongin Kim; Sung-Hwan Cheonan Kim; Sang-hyeop Lee; Sung-Ki Lee; Yoshikuni Suwon Nakadaira; Tae-Sung Cheonan Park

Archive | 2006

Halbleiterchippackungsvorrichtung und zugehöriges Endbehandlungsverfahren Semiconductor chip package device and associated finishing processes

Hee-Kook Choi; Ki-Kwon Jeong; Se-young Jeong; Nam-Seog Yongin Kim; Sung-Hwan Cheonan Kim; Sang-hyeop Lee; Sung-Ki Lee; Yoshikuni Suwon Nakadaira; Tae-Sung Cheonan Park

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Collaboration

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Seung-Hwan Lee

Samsung

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Young-sun Kim

Samsung Medical Center

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Young-wook Park

Samsung

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Hee-Kook Choi

Samsung

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Jin-seok Choi

Samsung

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Ju-Tae Moon

Samsung

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Kab-jin Nam

Samsung

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Kyunghoon Kim

Sungkyunkwan University

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Se-jin Shim

Samsung

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Seok-jun Won

Samsung

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