Sangsub Kim

Effects of electron trapping and interface state generation on bias stress induced in indium–gallium–zinc oxide thin-film transistors

The electrical characteristics of bias temperature stress (BTS) induced in amorphous indium–gallium–zinc oxide thin-film transistors (a-IGZO TFTs) were studied. We analyzed the threshold voltage (VTH) shift on the basis of the effects of positive bias temperature stress (PBTS) and negative bias temperature stress (NBTS), and applied it to the stretched-exponential model. Both stress temperature and bias are considered as important factors in the electrical instabilities of a-IGZO TFTs, and the stretched-exponential equation is well fitted to the stress condition. VTH for the drain current–gate voltage (IDS–VGS) curve and flat-band voltage (VFB) for the capacitance–voltage (C–V) curve move in the positive direction when PBTS is induced. However, in the case of NBTS, they move slightly in the negative direction. To clarify the VTH shift phenomenon by electron and hole injection, the average effective energy barrier (Eτ) is extracted, and the extracted values of Eτ under PBTS and NBTS are about 1.33 and 2.25 eV, respectively. The oxide trap charges (Not) of PBTS and NBTS calculated by C–V measurement are 4.4 × 1011 and 1.49 × 1011 cm−2, respectively. On the other hand, the border trap charges of PBTS and NBTS are 6.7 × 108 and 1.7 × 109 cm−2, respectively. This indicates that the increased interface trap charge, after PBTS is induced, captures electrons during detrap processing from the border trap to the conduction band, valence band, and interface trap.

Nonstoichiometric Solution-Processed BaTiO3 Film for Gate Insulator Applications

Solution processed barium titanate (BTO) was used to fabricate an Al/BaTiO3/p-Si metal-insulator-semiconductor (MIS) structure, which was used as a gate insulator. Changes in the electrical characteristics of the film were investigated as a function of the film thickness and post deposition annealing conditions. Our results showed that a thickness of 5 layers and an annealing temperature of 650 °C produced the highest electrical performance. BaxTi1-xO3 was altered at x = 0.10, 0.30, 0.50, 0.70, 0.90, and 1.0 to investigate changes in the electrical properties as a function of composition. The highest dielectric constant of 87 was obtained for x = 0.10, while the leakage current density was suppressed as Ba content increased. The lowest leakage current density was 1.34×10-10 A/cm2, which was observed at x = 0.90. The leakage current was related to the resistivity of the film, the interface states, and grain densification. Space charge limited current (SCLC) was the dominant leakage mechanism in BTO films based on leakage current analysis. Although a Ba content of x = 0.90 had the highest trap density, the traps were mainly composed of Ti-vacancies, which acted as strong electron traps and affected the film resistivity. A secondary phase, Ba2TiO4, which was observed in cases of excess Ba, acted as a grain refiner and provided faster densification of the film during the thermal process. The absence of a secondary phase in BaO (x = 1.0) led to the formation of many interface states and degradation in the electrical properties. Overall, the insulator properties of BTO were improved when the composition ratio was x = 0.90.

Electrical Characterization of Charge Polarity in AlF3 Anti-Reflection Layers for Complementary Metal Oxide Semiconductor Image Sensors

In this study, the charge polarity of aluminum fluoride (AlF3) as a function of varying thickness (tAlF3 = 20, 35, 50, 65, and 80 nm) was discussed. AlF3 films were deposited onto p-Si wafers via electron beam sputtering. Thickness dependent charge polarity and reliability issues under bias-temperature stress conditions were identified using a capacitance-voltage (C-V) characterization method. AlF3 was found to possess negative fixed charges, leading to a C-V curve shift toward the positive gate bias direction as tAlF3 was increased up to 50 nm. On the contrary, the C-V characteristics were dominantly affected by the positive charges of mobile ions and/or fluorine vacancies when tAlF3 was increased to more than 50 nm. Additionally, negative bias temperature stress (1 MV/cm, 473 K for 10 mins) increased insulator trapped charges and decreased interface traps in 20 nm thick AlF3 films. These results could be attributed to positively charged fluorine vacancies introduced by broken Al-F bonds within AlF3 films and the passivation of Si dangling bonds due to broken fluorine ions at the interface, respectively. It was believed that 20 nm thick AlF3 films sufficiently attracted holes from the Si substrate, forming a hole accumulation layer on the surface due to total charge polarity of the AlF3 dielectric being entirely governed by negative fixed charges as the thickness of AlF3 decreased. Based on these results, AlF3 films are proposed for use as an anti-reflection layer to replace HfO2 in CMOS image sensors.

Optimization of the Solution-Based Indium-Zinc Oxide/Zinc-Tin Oxide Channel Layer for Thin-Film Transistors

Double stacked indium-zinc oxide (IZO)/zinc-tin oxide (ZTO) active layers were employed in amorphous-oxide-semiconductor thin-film transistors (AOS TFTs). Channel layers of the TFTs were optimized by varying the molarity of ZTO back channel layers (0.05, 0.1, 0.2, 0.3 M) and the electrical properties of IZO/ZTO double stacked TFTs were compared to single IZO and ZTO TFTs with varying the molarity and molar ratio. On the basis of the results, IZO/ZTO (0.1 M) TFTs showed the excellent electrical properties of saturation mobility (13.6 cm2/V·s), on-off ratio (7×106), and subthreshold swing (0.223 V/decade) compared to ZTO (0.1 M) of 0.73 cm2/V · s, 1 × 107, 0.416 V/decade and IZO (0.04 M) of 0.10 cm2/V · s, 5 × 106, 0.60 V/decade, respectively. This may be attributed to diffusing Sn into front layer during annealing process. In addition, with varying molarity of ZTO back channel layer, from 0.1 M to 0.3 M ZTO back channel TFTs, electrical properties and positive bias stability deteriorated with increasing molarity of back channel layer because of increasing total trap states. On the other hand, 0.05 M ZTO back channel TFT had inferior electrical properties than that of 0.1 M ZTO back channel TFT. It was related to back channel effect because of having thin thickness of channel layer. Among these devices, 0.1 M ZTO back channel TFT had a lowest total trap density, outstanding electrical properties and stability. Therefore, we recommended IZO/ZTO (0.1 M) TFT as a promising channel structure for advanced display applications.

Effects of cementation factors on the Cu nanoparticle deposit of Cu-multi-wall carbon nanotubes composites.

Copper (Cu) coated carbon nanotubes (CNTs) were prepared and investigated by chemical reduction or cementation method. The morphology changes of Cu nanoparticles deposited onto the multiwall carbon nanotubes with metallic zinc (Zn) as a reducing agent have been examined at different cementation factors. The precipitated Cu nanoparticles from the copper ion in the reaction solution were deposited onto and entangled with the CNT substrates. CNTs used were multi-wall carbon nanotubes with average diameter of 10-20 nm and length of 10-50 μm. As-prepared CNTs products were purified by nitric acid solution, and then the CNTs were washed several times with distilled water, and dried in vacuum. The pre-treated CNTs were suspended in solvent. Then, the copper salt was dissolved in the suspension containing the CNTs. The deposited morphology and distribution of copper particles on the CNTs substrate were investigated by changing the solute, solvent and reducing agent. The Cu/CNTs agglomerates were obtained in the presence of copper chloride and copper sulphate salts, and water and ethanol were used as the solvents. And the raw CNTs were pretreated with glacial acetic acid for increasing the coverage rate of copper particles over the CNTs surface at different acid concentrations. The Cu deposited CNTs were characterized in respect of morphology and distribution of CNTs and Cu particles with field emission scanning electron microscopy (FESEM). The copper crystals were identified by X-ray diffraction patterns.