Satoshi Hatsukawa

Blocking Characteristics of 2.2 kV and 3.3 kV-Class 4H-SiC MOSFETs with Improved Doping Control for Edge Termination

Blocking characteristics of 2.2 kV and 3.3 kV -class 4H-SiC MOSFETs with various doping conditions for the edge termination region have been investigated. By optimizing the implanted dose into the edge termination structure consisting of junction termination extension (JTE) and field limiting ring (FLR), a breakdown voltage of 3,850 V for 3.3 kV -class MOSFET has been attained. This result corresponds to about 95% of the approximate parallel-plane breakdown voltage estimated from the doping concentration and the thickness of the epitaxial layer. Implanted doping for the JFET region is effective in reducing JFET resistance, resulting in the specific on-resistance of 14.2 mΩcm2 for 3.3 kV SiC MOSFETs. Switching characteristics at the high drain voltage of 2.0 kV are also discussed.

Newly Developed Switching Analysis Method for 3.3 kV 400 a Full SiC Module

We have demonstrated a new analysis method using a precise equivalent circuit of 3.3 kV 400 A full SiC modules and showed that the calculated waveforms well agree with the measured waveforms. We have also examined the current distribution in the module by utilizing this equivalent circuit model.

Low On-Resistance in 4H-SiC RESURF JFETs Fabricated with Dry Process for Implantation Metal Mask

We fabricated 4H-SiC lateral JFETs with a reduced surface field (RESURF) structure, which can prevent the concentration of electric field at the edge of the gate metal [1]. Previously, we reported on the 4H-SiC RESURF JFET with a gate length (LG) of 10 μm [2]. Its specific on-resistance was 50 mΩcm2, which was still high. Therefore, a Ti/W layer was used as an ion implantation mask so as to decrease the thickness of the mask and to improve an accuracy of the device process. A RESURF JFET with the gate length (LG) of 3.0 μm was fabricated, and the specific on-resistance of 6.3 mΩcm2 was obtained. In this paper, the fabrication process and the electrical characteristics of the device are described.

PWM Power Supply Using SiC RESURF JFETs with High Speed Switching

400V/2.5A 4H-SiC JFETs, having a reduced surface field (RESURF) structure have been fabricated. Measurements on the on-resistance, blocking, and switching characteristics were carried out. It was confirmed that the JFET has fast switching characteristics. A demonstration of a Pulse Width Modulation (PWM) decoder using JFETs was carried out. The input waveform, which is pulse width modulated 20.5MHz at 4.1MHz sine wave, as able to be decoded at 4.1MHz sine wave.

Fabrication of a multi-chip module of 4H-SiC RESURF-type JFETs

We fabricated a multi-chip module of 4H-SiC reduced surface field (RESURF)-type lateral JFETs. A single chip consists of 4 unit devices of 2.0 mm × 0.5 mm in size, which were isolated electrically from each other. The multi-chip module consists of 8 chips mounted on an AMC substrate. The drain current and the breakdown voltage of the module are over 3 A and 771 V, respectively. The turn-on time and the turn-off time are 36ns and 166ns, respectively. The module resistance is proportional to the absolute temperature to the 1.05th power.