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Satyendra Singh Chauhan

Texas Instruments

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Publication

Featured researches published by Satyendra Singh Chauhan.

Archive | 2003

Built-up bump pad structure and method for same

Masood Murtuza; Muthiah Venkateswaran; Satyendra Singh Chauhan

Archive | 2012

IC device having low resistance TSV comprising ground connection

Rajiv Dunne; Gary P. Morrison; Satyendra Singh Chauhan; Masood Murtuza; Thomas D. Bonifield

Archive | 2003

Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad

Masood Murtuza; Muthiah Venkateswaran; Satyendra Singh Chauhan

Archive | 2009

BONDING IC DIE TO TSV WAFERS

Yoshimi Takahashi; Masood Murtuza; Rajiv Dunne; Satyendra Singh Chauhan

Archive | 2004

Fine pitch low-cost flip chip substrate

Satyendra Singh Chauhan; Masood Murtuza

Archive | 2011

THRU SILICON ENABLED DIE STACKING SCHEME

Satyendra Singh Chauhan

Archive | 2007

Multi layer low cost cavity substrate fabrication for pop packages

Prema Palaniappan; Masood Murtuza; Satyendra Singh Chauhan

Archive | 2010

Dual carrier for joining ic die or wafers to tsv wafers

Yoshimi Takahashi; Masood Murtuza; Rajiv Dunne; Satyendra Singh Chauhan

Archive | 2009

IC HAVING VOLTAGE REGULATED INTEGRATED FARADAY SHIELD

Satyendra Singh Chauhan; Gregory E. Howard

Archive | 2008

Systems and methods for post-circuitization assembly

Masood Murtuza; Satyendra Singh Chauhan; Donald C. Abbott

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Collaboration

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Masood Murtuza

Texas Instruments

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Rajiv Dunne

Texas Instruments

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Gary P. Morrison

Texas Instruments

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Thomas D. Bonifield

Texas Instruments

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Donald C. Abbott

Texas Instruments

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Muthiah Venkateswaran

Texas Instruments

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Prema Palaniappan

Texas Instruments

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Yoshimi Takahashi

Texas Instruments

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Gregory E. Howard

Texas Instruments

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Marie Denison

Texas Instruments

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