Se-Jun Kim
SK Hynix
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Publication
Featured researches published by Se-Jun Kim.
IEEE Journal of Solid-state Circuits | 2002
Sang-Hoon Hong; Se-Jun Kim; Jae-Kyung Wee; Seongsoo Lee
A novel bitline sensing scheme is proposed for low-voltage DRAM to achieve low power dissipation and compatibility with low-voltage CMOS. One of the major obstacles in low-voltage DRAM is the degradation of data-retention time due to low signal level at the memory cell, which requires power-consuming refresh operations more frequently. This paper proposes an offset-cancellation sense-amplifier scheme (OCSA) that improves data-retention time significantly even at low supply voltage. It also improves die efficiency, because the proposed scheme reduces the number of sense amplifiers by supporting more cells in each sense amplifier. Measurements show that the data-retention time of the proposed scheme at 1.5-V supply voltage is 2.4 times of the conventional scheme at 2.0 V.
asian solid state circuits conference | 2006
Joohwan Cho; Ki Won Lee; Byoung-jin Choi; Geun-il Lee; Kwang-Jin Na; Ho-Don Jung; Wooyoung Lee; Ki-Chon Park; Yongsuk Joo; Jae-Hoon Cha; Se-Jun Kim; Young-Jung Choi; Patrik B. Moran; Jin-Hong Ahn; Joong-Sik Ki
Three circuit techniques for a 1.5 V, 512 Mb graphic DDR4 (GDDR4) SDRAM using a 90-nm DRAM process have been developed. First, a dual-clock system increases clocking accuracy and expands internal timing margins for harmonious core operation regardless of external clock frequency. Second, a four-phase data input strobe scheme helps to increase the input data valid window. Third, a fully analog delay-locked loop which provides a stable I/O clock and has 31.67 ps peak-to-peak jitter characteristics is designed. On the basis of these circuit techniques, the data rate is 3.2 Gbps/pin, which corresponds to 12.8 Gbps in times32 GDDR4-based I/O. Also, a multidivided architecture consisting of four independent 128 Mb core arrays is designed to reduce power line and output noise.
Focus on Powder Coatings | 2000
Jae-Kyung Wee; Si-Hong Kim; Yong-Jae Park; Se-Jun Kim; Jinyong Chung
This paper discusses the interconnect-related issues and general approaches in deep submicron technology. First, issues on interconnect library generation including simulations and measurements are discussed. Second, issues related to library-generating tools, which include parasitics extracting tools for early design stage and post-design stage, are analyzed. Third, issues are focused on design automation including chip floorplanner, interconnect-buffer optimizer, interconnect routing optimizer and so on. Finally we discuss our approach in DRAM technology. These interconnect-related items are relevant to chip families such as memory and logic device owing to hierarchical design concept, performance, cost, design-turn around times and so on.
Archive | 2003
Jin-Hong Ahn; Sang-Hoon Hong; Se-Jun Kim; Jae-Bum Ko
Archive | 2004
Se-Jun Kim; Sang-Hoon Hong; Jae-Bum Ko
Archive | 2003
Sang-Hoon Hong; Se-Jun Kim; Jeonghoon Kook
Archive | 2001
Se-Jun Kim; Jae-Kyung Wee; Yong-Jae Park
Archive | 2003
Se-Jun Kim; Sang-Hoon Hong; Jae-Bum Ko
Archive | 2003
Se-Jun Kim; Sang-Hoon Hong; Jae-Bum Ko
Archive | 2004
Sang-Hoon Hong; Jae-Bum Ko; Se-Jun Kim