Sebastien George

Flip-chip for space applications : Bonding reliability, DC and RF results

This paper presents a study of flip-chip bonding for space applications. DC and mechanical test vehicles have demonstrated the reliability of the flip-chip gold-gold thermocompression bonding up to 500 thermal cycles. RF test vehicles have proved the compatibility of both coplanar and microstrip on-the-shelves MMICs with the flip-chip bonding up to 35 GHz.

3D Beam Forming Network for High Integration Active Antennas

This paper describes current developments in Alcatel Space Industries carried out on a new concept of beam forming network, realized by molding assembly and using new 3D RF packaging technologies and interconnections. The aim is to be able to address a large panel of applications without any concept or technology major changes.

3D Active Modules for High Integration Active Antennas

This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly.