Seunghwan Yoon

20.2 A 16TX/16RX 60GHz 802.11ad chipset with single coaxial interface and polarization diversity

The IEEE 802.11ad standard supports PHY rates up to 6.7 Gbps on four 2 GHz-wide channels from 57 to 64 GHz. A 60 GHz system offers higher throughput than existing 802.11ac solutions but has several challenges for high-volume production including: integration in the host platform, automated test, and high link loss due to blockage and polarization mismatch. This paper presents a 802.11ad radio chipset capable of SC and OFDM modulation using a 16TX-16RX beamforming RF front-end, complete with an antenna array that supports polarization diversity. To aid low-cost integration in PC platforms, a single coaxial cable interface is used between chips. The chipset is capable of maintaining a link of 4.6 Gbps (PHY rate) at 10 m.

Polya Elements With Application to Antennas, Thin Absorbers and Filters

This article introduces the 2-D Polya fractal and its evolution into the modified Polya curve (MPC). The MPC is assigned a linewidth, which, together with the MPC order and shaping factor, provides optimization parameters for specific device applications. The MPCs are selected to generate useful shapes that fit within a chosen triangular envelope. These are applied as basis elements and are employed to organize families of polygonal shapes that may be used to design antennas, frequency-selective surfaces, metamaterials, ultrathin absorbers, and filters. MPCs may also be modified for implementation in 3-D geometries.

3D package-integrated artificial magnetic conductor antenna arrays for 60 GHz transceivers

Abstract We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45° scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11 × 11 mm2 package area, has a measured gain of 17 dBi at broadside and 15 dBi at 45° scan angle, while the smaller array, occupying a 6.6 × 11 mm2 package area, has a gain of 15 dBi at broadside and 14 dBi at a 45° scan angle. These arrays are an ideal 3D-integrated package solution for 60 GHz radio transceivers.