Shaji Farooq | Researchain

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Featured researches published by Shaji Farooq.

Archive | 1998

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

David L. Edwards; Glenn G. Daves; Shaji Farooq; Sushumna Iruvanti; Frank L. Pompeo

Archive | 2000

Polymer and ceramic composite electronic substrates

Daniel George Berger; Shaji Farooq; Lester Wynn Herron; James N. Humenik; John U. Knickerbocker; Robert W. Pasco; Charles Hampton Perry; Krishna G. Sachdev

Archive | 2000

Method for enhancing fatigue life of ball grid arrays

Peter J. Brofman; Mark G. Courtney; Shaji Farooq; Mario J. Interrante; Raymond A. Jackson; Gregory B. Martin; Sudipta K. Ray; William E. Sablinski; Kathleen A. Stalter

Archive | 1991

Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates

Farid Y. Aoude; Emanuel I. Cooper; Peter R. Duncombe; Shaji Farooq; E. A. Giess; Young-Ho Kim; Sarah H. Knickerbocker; Friedel Muller-Landau; Mark O. Neisser; Jae M. Park; Robert R. Shaw; Robert A. Rita; Thomas M. Shaw; Rao V. Vallabhaneni; Jon A. Van Hise; George Frederick Walker; Jungihl Kim; James M. Brownlow

Archive | 1997

Enhanced ceramic ball grid array using in-situ solder stretch with spring

Peter J. Brofman; Patrick A. Coico; Mark G. Courtney; H. Covell Ii James; Shaji Farooq; Lewis S. Goldmann; Raymond A. Jackson; David C. Linnell; Gregory B. Martin; Frank L. Pompeo; Kathleen A. Stalter; Hilton T. Toy

Archive | 2001

Process for forming cone shaped solder for chip interconnection

Peter J. Brofman; Shaji Farooq; John U. Knickerbocker; Scott I. Langenthal; Sudipta K. Ray; Kathleen A. Stalter

Archive | 2000

Structure, materials, and methods for socketable ball grid

Anson J. Call; Stephen A. DeLaurentis; Shaji Farooq; Sung Kwon Kang; Sampath Purushothaman; Kathleen A. Stalter

Archive | 1995

Large ceramic article and method of manufacturing

Raschid J. Bezama; Jon A. Casey; Mario Enrique Ecker; Shaji Farooq; Irene S. Frantz; Katherine G. Frase; David H. Gabriels; Lester Wynn Herron; John U. Knickerbocker; Sarah H. Knickerbocker; Govindarajan Natarajan; John Thomson; Yee-Ming Ting; Sharon L. Tracy; Robert M. Troncillito; Vivek M. Sura; Donald R. Wall; Giai V. Yen

Archive | 2000

Electrical interconnection package and method thereof

Raymond A. Jackson; Anson J. Call; Mark G. Courtney; Stephen A. DeLaurentis; Mukta S. Farooq; Shaji Farooq; Lewis S. Goldmann; Gregory B. Martin; Sudipta K. Ray

Archive | 1998