Kathleen A. Stalter

Handbook of lead-free solder technology for microelectronic assemblies

Background and Driving Forces. Materials and Manufacturing Considerations. Reliability Considerations.

Flip-Chip Die Attach Technology

Wire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.

Low-cost, high reliability flip-chip removal for multi-chip modules

The prevalent trend to consolidate devices onto multi-chip modules due to electrical performance benefits and printed circuit board real-estate constraints drives the need to have a device replacement technology. The ability to remove and replace devices, for either defective conditions or upgrade level designs, while preserving the electrical integrity and reliability of the other components on the module at various stages of manufacture is essential. It is not a cost-effective option to discard the remaining expensive die or to scrap the fully assembled complex module. The process must also be able to be exercised easily in a development environment where resources are at a minimum, but the learning generated through the ability to perform such operations in-situ is imperative. With the emergence of OEM assembly vendors, this technique and process must also be simple, inexpensive and easy to use, as a company should not be required to invest large resources in remove and replace manufacturing operations.

Solder Bump Flip-Chip Replacement Technology on Ceramic Carriers

The industry has focused on replacing packaged chips such as pin-in-hole (PIH) and surface-mount components (SMT) on cards or boards. Components which do not pass electrical test or inspection are removed from cards but not chips from single chip packages. In some instances, such as plastic molded packages, removal is not a viable option.