Sheila Hurtt

InP Photonic Integrated Circuits

InP is an ideal integration platform for optical generation, switching, and detection components operating in the range of 1.3-1.6 m wavelength, which is preferred for data transmission in the most prevalent silica-based optical fiber. We review the current state of the art in advanced InP photonic ICs.

Large-scale photonic integrated circuits for long-haul transmission and switching

Feature Issue on Nanoscale Integrated Photonics for Optical Networks Dense wavelength division multiplexed (DWDM) large-scale, single-chip transmitter and receiver photonic integrated circuits (PICs), each capable of operating at 100 Gbits/s, have been deployed in the field since the end of 2004. These highly integrated InP chips have significantly changed the economics of long-haul optical transport networks. First, a review of the ten-channel, 100 Gbits/s PIC is presented. Then two extensions of the technology are demonstrated; first is wide temperature, coolerless operation of the 100 Gbits/s PIC, and second is a single integrated chip with 40 channels operating at 40 Gbits/s, capable of an aggregate data rate of 1.6 Tbits/s.

InP-based photonic integrated circuits: Technology and manufacturing

Large-scale InP-based photonic integrated circuits were first introduced in 2004, representing over an order-of-magnitude increase in integration complexity for commercial InP devices. In this talk we will review recent developments and manufacturing of these novel components.

Volume manufacturing and deployment of large-scale photonic integrated circuits

Manufacturing statistics are presented for 100 Gb/s transmitter and receiver large-scale photonic integrated circuits (LS-PICs). The data demonstrate the feasibility of the cost-effective deployment and volume manufacturing of these devices

40-Channel Transmitter and Receiver Photonic Integrated Circuits Operating at a per Channel Data Rate 12.5Gbit/s

We demonstrate 40 channel transmitter and receiver large scale photonic integrated circuits operating as a pair at 12.5 Gbit/s.

Ultra High Capacity WDM Photonic Integrated Circuits

Design and performance of large scale, dense wavelength division multiplexed InP transmitter and receiver photonic integrated circuits (PICs) are reviewed. The PICs are capable of transmitting and receiving up to 40 wavelengths at data rates up to 40 Gbit/s per channel.

Large-Scale Photonic Integrated Circuits

We review our work in the area of large scale InP photonic integrated circuits (PIC). We will review dense wavelength division multiplexed (DWDM) transmitter and receiver PICs with up to 40 channels, and operating at data rates up to 40 Gbit/s.

The first commercial large-scale InP photonic integrated circuits: current status and performance

Summary form only given. Infinera has commercialized the first digital transport network (DTN) systems as a highly reliable, small footprint system to the telecommunications carriers. The key technology in the DTN is optical-electrical-optical (O-E-O) digital signal processing. O-E-O processing allows the carriers to install systems at more locations, which translates into more entry points into the network. The photonic integrated circuit, or PIC, enables cost-effective O-E-O processing. While research had been ongoing for several decades, Infinera systems are the first to incorporate large-scale photonic integration. Infineras commercially deployed PICs operate at 100 Gb/s on 10 channels (10Gb/s per channel). Each transmit PIC channel consists of a tunable DFB, modulator, power monitor and variable optical attenuator (VOA). The PIC has been deployed worldwide, demonstrating an excellent reliability track-record. The challenges met in commercializing this chip, including the tradeoff between performance, reliability, and a robust processing methodology, will be discussed as well the latest development results, wherein we have demonstrated transmitter chips integrating over 240 elements with a aggregate capacity of 1.6 Tb/s.

Large Scale InP Photonic Integrated Circuits for High Speed Optical Transport

Radhakrishnan Nagarajan, Masaki Kato, Vince Dominic, Jacco Pleumeekers, Andrew Dentai, Peter Evans, Sheila Hurtt, Johan Bäck, Damien Lambert, Mark Missey, Atul Mathur, Sanjeev Murthy, Randal Salvatore, Charles Joyner, Richard Schneider, Mehrdad Ziari, Jeffrey Bostak, Mike Kauffman, Huan-Shang Tsai, Michael Van Leeuwen, Alan Nilsson, Robert Taylor, Stephen Grubb, David Mehuys, Fred Kish and David Welch Infinera, 1322 Bordeaux Drive, Sunnyvale, CA 94089 rnagarajan@infinera.com

Large-Scale DWDM Photonic Integrated Circuits

A review of high density, dense wavelength division multiplexed photonic integrated circuits is presented. These integrated circuits have 10 channels or more with aggregate data rates up to 400Gbit/s.