Shigeru Tahara
Tokyo Electron
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Publication
Featured researches published by Shigeru Tahara.
international interconnect technology conference | 2015
Lianggong Wen; Fumiko Yamashita; Baojun Tang; Kristof Croes; Shigeru Tahara; Keiichi Shimoda; Takeru Maeshiro; Eiichi Nishimura; Frederic Lazzarino; Ivan Ciofi; Jürgen Bömmels; Zsolt Tokei
Cu wires patterning by direct etch methods is investigated at 300mm wafer level. Cross-sectional sidewall profiles with tapering angles around 74.5° are obtained with a mid-line width of 44 nm, which paves the way to further scaling of this technique. Lower resistivity is demonstrated with respect to conventional Cu damascene process, with low leakage current between adjacent Cu lines. An in-situ 10nm SiN cap is deposited as a passivation to enable electrical and reliability tests. The electromigration (EM) characterization shows promising reliability performance of the direct etched Cu wires.
Archive | 2002
Akira Koshiishi; Mitsuru Hashimoto; Hideaki Tanaka; Shigeru Tahara; Kunihiko Hinata; Jun Ooyabu
Archive | 2010
Ryuichi Asako; Gousuke Shiraishi; Shigeru Tahara
Archive | 2011
Shigeru Tahara; Naotsugu Hoshi
Archive | 2007
Akira Koshiishi; Noriyuki Kobayashi; Shigeru Yoneda; Kenichi Hanawa; Shigeru Tahara; Masaru Sugimoto
Archive | 2008
Kazuhiro Kubota; Shigeru Tahara; Ryuichi Asako
Archive | 2007
Akira Koshiishi; Noriyuki Kobayashi; Shigeru Yoneda; Kenichi Hanawa; Shigeru Tahara; Masaru Sugimoto
Archive | 2009
Reiko Sasahara; Jun Tamura; Shigeru Tahara
Archive | 2013
Boon Teik Chan; Shigeru Tahara
Archive | 2008
Yuki Chiba; Shigeru Tahara
